參數(shù)資料
型號： HF30C120ACE
文件頁數(shù)： 1/1頁
文件大小： 16K
代理商： HF30C120ACE
HF30C120ACE
Preliminary Data Sheet PD-20502 rev. A 11/98
Hexfred Die in Wafer Form
1200 V
Size 30
5" Wafer
Nominal Back Metal Composition, Thickness
Nominal Front Metal Composition, Thickness
Chip Dimensions
Wafer Diameter
Wafer Thickness
Relevant Die Mechanical Dwg. Number
Minimum Street Width
Reject Ink Dot Size
Recommended Storage Environment
Cr-Ni-Ag ( 1kA-4kA-6kA )
99% Al, 1% Si (3 microns)
0.115" x 0.155"
125mm, with std. < 100 > flat
.015" ± .003"
01-5167
100 Microns
0.25mm Diameter Minimum
Store in original container, in dessicated
nitrogen, with no contamination
Mechanical Data
Die Outline
Reference Standard IR packaged part ( for design ) : HFA08PB120
Parameter
V
FM
BV
R
I
RM
Description
Guaranteed (Min/Max)
2.8V Max.
1200V Min.
10μA Max.
Test Conditions
Forward Voltage
Reverse Breakdown Voltage
Reverse Leakage Current
T
J
= 25°C, I
F
= 4.0A
T
J
= 25°C, I
R
= 200μA
T
J
= 25°C, V
R
= 1200V
Electrical Characteristics ( Wafer Form )
NOTES :
1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS ( INCHES )
2. CONTROLLING DIMENSION : ( INCH )
3. DIMENSIONAL TOLERANCES :
BONDING PADS : < 0.635 TOLERANCE = ± 0.013
WIDTH
< (.0250) TOLERANCE = ± (.0005)
&
> 0.635 TOLERANCE = ± 0.025
LENGTH
> (.0250) TOLERANCE = ± (.0010)
OVERALLDIE
< 1.270 TOLRANCE = ± 0.102
WIDTH
< (.050) TOLERANCE = ± (.004)
&
> 1.270 TOLERANCE = ± 0.203
LENGTH
> (.050) TOLERANCE = ± (.008)
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