• 參數(shù)資料
    型號(hào): HDSM2-152SL5B8-0.5
    元件分類: 電信和以太網(wǎng)連接器
    英文描述: 152 CONTACT(S), FEMALE, STRAIGHT TELECOM AND DATACOM CONNECTOR, SOLDER, RECEPTACLE
    文件頁數(shù): 1/4頁
    文件大小: 302K
    代理商: HDSM2-152SL5B8-0.5
    Catalog 1308638
    Dimensions are in inches and
    Dimensions are shown for
    USA: 1-800-522-6752
    South America: 55-11-3611-1514
    Revised 8-05
    millimeters unless otherwise
    reference purposes only.
    Canada: 1-905-470-4425
    Hong Kong: 852-2735-1628
    specified. Values in brackets
    Specifications subject
    Mexico: 01-800-733-8926
    Japan: 81-44-844-8013
    www.tycoelectronics.com
    are metric equivalents.
    to change.
    C. America: 52-55-5-729-0425
    UK: 44-141-810-8967
    Rectangular Connectors
    51
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    High Density Standard Module (HDSM) Connectors
    Features
    I Designed for surface
    mounting on both daughter
    board and mother board for
    increased circuit density
    I Basic design offers 38, 78,
    120, 152, 200, 304, and 400
    contact designs
    I High reliability twist pin and
    socket per MIL-DTL-83513
    and MIL-DTL-55302
    I Connector permits lateral
    movement of daughter
    board to accommodate
    clamping of the heatsink
    I Plated through-hole
    mounting available
    I Available with flying leads
    I Extender card option
    available
    I Typical mating force for 304
    contacts is 38 pounds
    I Designed to withstand vapor
    phase soldering
    I Two rotatable (six position)
    polarizing keys are provided
    accommodating 36 possible
    combinations
    I Jackscrew hardware
    available; consult
    Tyco Electronics
    I Different modular inserts
    may be specified to include
    coax (Pixi/Con), fiber optic
    or other special contacts
    I Inserts may be partially or
    fully loaded and installed in
    the connector shell in
    various configurations
    The MICRODOT HDSM
    connector is designed for
    4 row .050 [1.27] pitch
    density with a special low
    force twist pin that meets
    all requirements of MIL-
    DTL-55302 and MIL-DTL-
    83513. This high density
    connector allows the use of
    construction to double the
    packaging density with
    surface mount capability.
    Performance Data Summary
    Electrical
    Contacts — Pin 24 AWG twist pin,
    Socket #24 AWG, Wire range 24 AWG to
    32 AWG solid and stranded.
    Contact Resistance (voltage drop)
    25 millivolts max. at 3 amps, 25° ± 3° C.
    Current Rating — 3 amps max. per
    contact
    Dielectric Withstanding Voltage
    Volts RMS 60 Hz at room ambient:
    600 V for solder pots at sea level.
    150 V for solder pots at 70,000 ft.
    [21,336m]
    500 V for wire terminations at sea level.
    200 V for wire terminations at 70,000 ft.
    Insulation Resistance — 5,000
    megohms min. at room ambient.
    Magnetic Permeability — 2 m max.
    Mechanical
    Contact Spacing — .050 [1.27] centers
    Contact Engagement &
    Separation — 5.0 oz max. [1.39N]
    (eng.) 0.5 oz. min. [.14N] 3.5 oz. typ.
    [.97N] (sep.) force.
    Materials and Finishes
    Contacts — Copper alloy plated with
    .000050 [0.00127] gold over copper
    flash per MIL-G-45204, Type II.
    Metal Shell
    Insulator — Liquid Crystal Polymer
    (LCP) per ASTM D5138 or
    Polyphenylene Sulfide per
    MIL-M-24519
    Body Shell — Aluminum alloy plated
    Nickel, electroless per MIL-C-26074.
    Environmental
    Temperature Range
    -67°F to 257°F [-55° C to +125° C].
    Vibration — No discontinuity in
    excess of 1 micro sec. when tested in
    accordance with MIL-STD-1344,
    Method 2005, test Condition IV.
    Insulator Retention — Inserts will
    withstand a 50 lb. per square inch load
    in either direction.
    Shock — No discontinuity in excess of
    1 micro sec. when tested in accordance
    with MIL-STD-1344, Method 2004, test
    Condition E.
    Durability — No mechanical or electri-
    cal defects detrimental to the function of
    the connectors after 500 cycles of mat-
    ing and unmating. (Caution: Mating
    force increases during durability cycling
    may be noted).
    Humidity — After exposure to humidi-
    ty as specified by MIL-STD-1344,
    Method 1002, Type II, IR shall be 1
    megohm min. immediately following
    step 7a of Method 1002 and 1000
    megohms min. after 24 hours of condi-
    tioning per Method 1002.
    Salt Spray — Connectors shall meet
    the performance requirements of contact
    resistance, mating and unmating forces,
    and contact retention after being subject-
    ed to the 48-hour 5% solution salt spray
    test per MIL-STD-1344, Method 1001,
    Condition B.
    Crimp Termination Tensile
    Strength — *Unassembled contacts
    with crimped stranded wire terminations.
    Wires will not pull out of contacts when
    the following axial loads are applied:
    24 AWG, 5 lbs., 26 AWG, 4 lbs.,
    28 AWG, 3 lbs.
    相關(guān)PDF資料
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