參數(shù)資料
        型號(hào): HDSM2-152SL4A9-0.5
        元件分類: 電信和以太網(wǎng)連接器
        英文描述: 152 CONTACT(S), FEMALE, STRAIGHT TELECOM AND DATACOM CONNECTOR, SOLDER, RECEPTACLE
        文件頁數(shù): 1/4頁
        文件大小: 302K
        代理商: HDSM2-152SL4A9-0.5
        Catalog 1308638
        Dimensions are in inches and
        Dimensions are shown for
        USA: 1-800-522-6752
        South America: 55-11-3611-1514
        Revised 8-05
        millimeters unless otherwise
        reference purposes only.
        Canada: 1-905-470-4425
        Hong Kong: 852-2735-1628
        specified. Values in brackets
        Specifications subject
        Mexico: 01-800-733-8926
        Japan: 81-44-844-8013
        www.tycoelectronics.com
        are metric equivalents.
        to change.
        C. America: 52-55-5-729-0425
        UK: 44-141-810-8967
        Rectangular Connectors
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        High Density Standard Module (HDSM) Connectors
        Features
        I Designed for surface
        mounting on both daughter
        board and mother board for
        increased circuit density
        I Basic design offers 38, 78,
        120, 152, 200, 304, and 400
        contact designs
        I High reliability twist pin and
        socket per MIL-DTL-83513
        and MIL-DTL-55302
        I Connector permits lateral
        movement of daughter
        board to accommodate
        clamping of the heatsink
        I Plated through-hole
        mounting available
        I Available with flying leads
        I Extender card option
        available
        I Typical mating force for 304
        contacts is 38 pounds
        I Designed to withstand vapor
        phase soldering
        I Two rotatable (six position)
        polarizing keys are provided
        accommodating 36 possible
        combinations
        I Jackscrew hardware
        available; consult
        Tyco Electronics
        I Different modular inserts
        may be specified to include
        coax (Pixi/Con), fiber optic
        or other special contacts
        I Inserts may be partially or
        fully loaded and installed in
        the connector shell in
        various configurations
        The MICRODOT HDSM
        connector is designed for
        4 row .050 [1.27] pitch
        density with a special low
        force twist pin that meets
        all requirements of MIL-
        DTL-55302 and MIL-DTL-
        83513. This high density
        connector allows the use of
        construction to double the
        packaging density with
        surface mount capability.
        Performance Data Summary
        Electrical
        Contacts — Pin 24 AWG twist pin,
        Socket #24 AWG, Wire range 24 AWG to
        32 AWG solid and stranded.
        Contact Resistance (voltage drop)
        25 millivolts max. at 3 amps, 25° ± 3° C.
        Current Rating — 3 amps max. per
        contact
        Dielectric Withstanding Voltage
        Volts RMS 60 Hz at room ambient:
        600 V for solder pots at sea level.
        150 V for solder pots at 70,000 ft.
        [21,336m]
        500 V for wire terminations at sea level.
        200 V for wire terminations at 70,000 ft.
        Insulation Resistance — 5,000
        megohms min. at room ambient.
        Magnetic Permeability — 2 m max.
        Mechanical
        Contact Spacing — .050 [1.27] centers
        Contact Engagement &
        Separation — 5.0 oz max. [1.39N]
        (eng.) 0.5 oz. min. [.14N] 3.5 oz. typ.
        [.97N] (sep.) force.
        Materials and Finishes
        Contacts — Copper alloy plated with
        .000050 [0.00127] gold over copper
        flash per MIL-G-45204, Type II.
        Metal Shell
        Insulator — Liquid Crystal Polymer
        (LCP) per ASTM D5138 or
        Polyphenylene Sulfide per
        MIL-M-24519
        Body Shell — Aluminum alloy plated
        Nickel, electroless per MIL-C-26074.
        Environmental
        Temperature Range
        -67°F to 257°F [-55° C to +125° C].
        Vibration — No discontinuity in
        excess of 1 micro sec. when tested in
        accordance with MIL-STD-1344,
        Method 2005, test Condition IV.
        Insulator Retention — Inserts will
        withstand a 50 lb. per square inch load
        in either direction.
        Shock — No discontinuity in excess of
        1 micro sec. when tested in accordance
        with MIL-STD-1344, Method 2004, test
        Condition E.
        Durability — No mechanical or electri-
        cal defects detrimental to the function of
        the connectors after 500 cycles of mat-
        ing and unmating. (Caution: Mating
        force increases during durability cycling
        may be noted).
        Humidity — After exposure to humidi-
        ty as specified by MIL-STD-1344,
        Method 1002, Type II, IR shall be 1
        megohm min. immediately following
        step 7a of Method 1002 and 1000
        megohms min. after 24 hours of condi-
        tioning per Method 1002.
        Salt Spray — Connectors shall meet
        the performance requirements of contact
        resistance, mating and unmating forces,
        and contact retention after being subject-
        ed to the 48-hour 5% solution salt spray
        test per MIL-STD-1344, Method 1001,
        Condition B.
        Crimp Termination Tensile
        Strength — *Unassembled contacts
        with crimped stranded wire terminations.
        Wires will not pull out of contacts when
        the following axial loads are applied:
        24 AWG, 5 lbs., 26 AWG, 4 lbs.,
        28 AWG, 3 lbs.
        相關(guān)PDF資料
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