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參數(shù)資料
| 型號： | HDB-M4-160M226J |
| 廠商： | AMPHENOL CORP |
| 元件分類： | 電路板相疊連接器 |
| 英文描述： | 160 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER |
| 文件頁數(shù)： | 1/5頁 |
| 文件大?。?/td> | 791K |
| 代理商： | HDB-M4-160M226J |
1
Product Data Sheet
Amphenol HDB3 Series High Density
Mother Board & Daughter Board Connectors
No. 201-3
Rectangular Interconnects with
.070” X .060” Grid Spacing
This new connector series incorporates a higher
density contact pattern and lower mated height
than Amphenol’s original Low Mating Force rectan-
gular connectors while utilizing the same durable
and reliable B3 contact.
The B3 brush (bristle brush bunch) contact is
comprised of multiple strands of high tensile wire
that intermesh to create an electrical connection.
Amphenol
HDB 3 Mother Board
Connector
HDB 3 Daughter Board
Connector
BENEFITS OF THE BRUSH CONTACT
Redundant current paths: 14-70 gas tight points
of contact per mated bunch
Very smooth low friction interface
Low mating forces: 1.5 oz. typical per contact,
70-90% lower than conventional contacts
Long contact life: 100,000 cycles of mating and
unmating without performance degradation
Documented intermittency free performance: No
10 nano-second discontinuities during
50,000,000 cycles of 0.010” displacement
Impervious to fretting
Contact interface meets M55302/166 thru /171
@2009 Amphenol Corporation
Printed in U.S.A.
1/8/2009
HDB3 FEATURES
Polarization:
“D” shaped design
Keying:
Optional keys offer 36 unique
keying combinations
Guide Pins
Optional guide pins provide
additional alignment
Radial Misalignment:
Capable of correcting up to a
.020" initial radial misalign-
ment
Angular Misalignment:
Capable of mating with up to a
2° initial angular misalignment
HDB3 CONNECTOR PERFORMANCE
Durability:
100,000 mating cycles
Insertion/Extraction Force:
1.5 ounce typical per contact
Operating Temperature:
-65° to 150°C
Current Rating:
2 amperes
Hot swap 1 ampere maximum
(load dependent)
Insulation Resistance:
5 gigaohms minimum
Dielectric Withstanding
Voltage:
750 volts, 60 hertz, rms @ Sea
Level 250 volts, 60 hertz,
rms @ 70,000 feet Elevation
Solderability:
MIL-STD-202, Method 208
Salt Fog:
48 Hours IAW MIL-STD-1344,
method 1001, test condition B
Humidity:
IAW MIL-STD-1344, method
1002, type II
Vibration:
4 hours in each of 3 mutually
perpendicular axes IAW MIL-ST
1344, method 2005,
test condition V, letter H
Shock:
1 shock along each of three
mutually perpendicular axes IAW
MIL-STD-1344, method 2004,
test condition G
Data Rate:
Capable of 3.125 Gbps (consult
Amphenol for arrangement)
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