參數(shù)資料
型號： HD64F7055
英文描述： SuperH RISC engine SH-2E Programming Manual
中文描述： SuperH RISC引擎上海2E的編程手冊
文件頁數(shù)： 29/67頁
文件大小： 382K
代理商： HD64F7055
Rev. 2.0, 03/06/02, 26
2.6
Building a Project
The outline of the build process is shown in figure 2.1.
2.6.1
Building a Project
The build option only compiles or assembles those files that have changed since the last build. Additionally, it
will rebuild source files if they depend upon a file that has changed since the last build. For instance, if the file
“test.c” #include’s the file “header.h” and the latter has changed since the last build, the file “test.c” will be
recompiled.
To perform a build:
Select [Build->Build] or click the build toolbar button (
) or press F7 or click the right mouse button on a
project icon in the “Projects” tab of the “Workspace” window and select [Build] from the pop-up menu.
The build all option compiles and assembles all source files, irrespective of whether they have been modified or
not, and links all of the new object files produced.
To perform a build all:
Select [Build->Build All], or click the build all toolbar button (
), or click the right mouse button on a
project icon in the “Projects” tab of the “Workspace” window and select [Build All] from the pop-up menu.
Both the build and the build all will terminate if any of the project files produce errors.
2.6.2
Building Individual Files
The Hitachi Embedded Workshop lets you build project files individually.
To build an individual file:
1. Select the file which you want to build from the project window.
2. Select [Build->Build File], click the build file toolbar button (
) or press CTRL+F7 or click the right
mouse button on a file icon in the “Projects” tab of the “Workspace” window and select [Build <file>]
from the pop-up menu.
相關(guān)PDF資料
PDF描述
HD64F7065 SH7065 Hardware Manual
HD64F7144 Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Debugger Users Manual/Cross tool
HD64F7145 High-Performance Debugging Interface Users Manual/Cross tool
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
HD64F7055RFL40 制造商:Renesas Electronics Corporation 功能描述:
HD64F7065AF60 功能描述:IC SUPERH MCU FLASH 256K 176QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:SuperH® SH7060 標(biāo)準(zhǔn)包裝:160 系列:S08 核心處理器:S08 芯體尺寸:8-位 速度:40MHz 連通性:I²C，LIN，SCI，SPI 外圍設(shè)備:LCD，LVD，POR，PWM，WDT 輸入/輸出數(shù):53 程序存儲器容量:32KB（32K x 8） 程序存儲器類型:閃存 EEPROM 大小:- RAM 容量:1.9K x 8 電壓 - 電源 (Vcc/Vdd):2.7 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 12x12b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 105°C 封裝/外殼:64-LQFP 包裝:托盤
HD64F7065AF60V 功能描述:MCU 3V 256K PB-FREE 176-QFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:SuperH® SH7060 標(biāo)準(zhǔn)包裝:160 系列:S08 核心處理器:S08 芯體尺寸:8-位 速度:40MHz 連通性:I²C，LIN，SCI，SPI 外圍設(shè)備:LCD，LVD，POR，PWM，WDT 輸入/輸出數(shù):53 程序存儲器容量:32KB（32K x 8） 程序存儲器類型:閃存 EEPROM 大小:- RAM 容量:1.9K x 8 電壓 - 電源 (Vcc/Vdd):2.7 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 12x12b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 105°C 封裝/外殼:64-LQFP 包裝:托盤
HD64F7065AF60-V 制造商:Renesas Electronics Corporation 功能描述:MCU 32-bit SuperH RISC 256KB Flash 3.3V 176-Pin LQFP 制造商:Renesas Electronics Corporation 功能描述:IC,microcontroller,SH2,32-bit, 制造商:Renesas 功能描述:MCU 32-bit SuperH RISC 256KB Flash 3.3V 176-Pin LQFP
HD64F7144F50 制造商:Renesas Electronics Corporation 功能描述:MCU 32-Bit SuperH RISC 256KB Flash 3.3V 112-Pin PQFP 制造商:Renesas Electronics Corporation 功能描述:MCU 32BIT SUPERH RISC 256KB FLASH 3.3V 112PQFP - Trays 制造商:Renesas Electronics 功能描述:MCU 32-Bit SuperH RISC 256KB Flash 3.3V 112-Pin PQFP Tray 制造商:Renesas 功能描述:MCU 32-Bit SuperH RISC 256KB Flash 3.3V 112-Pin PQFP
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