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| 型號： | HD64F7054 |
| 英文描述： | SuperH RISC Engine SH-DSP Software Application Notes/Q&A |
| 中文描述： | SuperH RISC引擎的SH - DSP軟件應用筆記/ Q首頁 |
| 文件頁數(shù)： | 64/67頁 |
| 文件大小： | 382K |
| 代理商： | HD64F7054 |
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Rev. 2.0, 03/06/02, 58
3.10
Generating a Makefile
The HEW allows you to generate a makefile, which can be used to build parts of your workspace without HEW.
This is particularly useful of you want to send a project to a user who does not have the HEW or if you want to
version control an entire build, including the make components.
To generate a makefile:
1. Ensure that the project, which you want to generate a makefile for, is the current project.
2. Ensure that the build configuration that you want to build the project with is the current configuration.
3.
Select [Build>Generate Makefile].
4.
Once this menu has been selected a dialog is displayed which asks the user what parts of the workspace
need to be added to the make file. (See figure 3.23.)
5.
Select the radio button which is relevant for your make file and then click OK.
Figure 3.23: Generate makefile Dialog
The HEW will create a subdirectory “make” within the current workspace directory and then generate the
makefile into it. It is named after the selection, with a .mak extension for example the current project and
configuration(e.g. project_debug.mak). The executable HMAKE.EXE, located in the HEW installation directory,
is provided for you to execute the makefiles generated by the HEW. It is not intended to execute makefiles,
which have been user modified.
To execute a makefile:
1. Open a command window and change to the “make” directory where the makefile was generated.
2. Execute HMAKE. Its command line is HMAKE.EXE <makefile>.
Note:
The degree portability of a generated makefile is entirely dependent upon how portable the project itself
is. For example, any compiler options, which include full paths to an output directory or include file
directory, will mean that, when given to another user with a different installation, the build will probably
fail. In general use placeholders wherever possible – using a full, specific path should be avoided when
possible.
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| HD64F7144 | Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Debugger Users Manual/Cross tool |
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| HD64F7055RFL40 | 制造商:Renesas Electronics Corporation 功能描述: |
| HD64F7065AF60 | 功能描述:IC SUPERH MCU FLASH 256K 176QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:SuperH® SH7060 標準包裝:160 系列:S08 核心處理器:S08 芯體尺寸:8-位 速度:40MHz 連通性:I²C，LIN，SCI，SPI 外圍設備:LCD，LVD，POR，PWM，WDT 輸入/輸出數(shù):53 程序存儲器容量:32KB（32K x 8） 程序存儲器類型:閃存 EEPROM 大小:- RAM 容量:1.9K x 8 電壓 - 電源 (Vcc/Vdd):2.7 V ~ 5.5 V 數(shù)據(jù)轉換器:A/D 12x12b 振蕩器型:內部 工作溫度:-40°C ~ 105°C 封裝/外殼:64-LQFP 包裝:托盤 |
| HD64F7065AF60V | 功能描述:MCU 3V 256K PB-FREE 176-QFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:SuperH® SH7060 標準包裝:160 系列:S08 核心處理器:S08 芯體尺寸:8-位 速度:40MHz 連通性:I²C，LIN，SCI，SPI 外圍設備:LCD，LVD，POR，PWM，WDT 輸入/輸出數(shù):53 程序存儲器容量:32KB（32K x 8） 程序存儲器類型:閃存 EEPROM 大小:- RAM 容量:1.9K x 8 電壓 - 電源 (Vcc/Vdd):2.7 V ~ 5.5 V 數(shù)據(jù)轉換器:A/D 12x12b 振蕩器型:內部 工作溫度:-40°C ~ 105°C 封裝/外殼:64-LQFP 包裝:托盤 |
| HD64F7065AF60-V | 制造商:Renesas Electronics Corporation 功能描述:MCU 32-bit SuperH RISC 256KB Flash 3.3V 176-Pin LQFP 制造商:Renesas Electronics Corporation 功能描述:IC,microcontroller,SH2,32-bit, 制造商:Renesas 功能描述:MCU 32-bit SuperH RISC 256KB Flash 3.3V 176-Pin LQFP |
| HD64F7144F50 | 制造商:Renesas Electronics Corporation 功能描述:MCU 32-Bit SuperH RISC 256KB Flash 3.3V 112-Pin PQFP 制造商:Renesas Electronics Corporation 功能描述:MCU 32BIT SUPERH RISC 256KB FLASH 3.3V 112PQFP - Trays 制造商:Renesas Electronics 功能描述:MCU 32-Bit SuperH RISC 256KB Flash 3.3V 112-Pin PQFP Tray 制造商:Renesas 功能描述:MCU 32-Bit SuperH RISC 256KB Flash 3.3V 112-Pin PQFP |
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