參數(shù)資料
型號： HD64F7046
英文描述： SuperH RISC Engine SH-DSP Software Application Notes/Q&A
中文描述： SuperH RISC引擎的SH - DSP軟件應(yīng)用筆記/ Q首頁
文件頁數(shù)： 10/67頁
文件大?。?/td> 382K
代理商： HD64F7046
Rev. 2.0, 03/06/02, 9
2.
Build Basics
This chapter explains the general functions of the HEW whilst the more advanced features can be found in
chapter 3, “Advanced Build Features”.
2.1
The Build Process
The typical build process is outlined in figure 2.1. This may not be the exact build process, which your
installation of HEW will use as it depends upon the tools that were provided with your installation of HEW (e.g.
you may not have a compiler for instance). In any case, the principles are the same - each step or phase of the
build takes a set of project files and then builds them, if all succeeds then the next step or phase is executed.
Project
Object
Files
C
Source Files
Assembler
Source Files
Library
Files
Load
Module
BUILD
COMPILER
ASSEMBLER
LINKER
Figure 2.1: Typical Build Process
In the example shown in figure 2.1 the compiler is the first phase, the assembler is the second phase and the
linker is the third and final phase. During the compiler phase, the C source files from the project are compiled in
turn, during the assembler phase, the assembler source files are assembled in turn. During the linker phase all
library files and output files from the compiler and assembler phases are linked together to produce the load
module. This module can then be downloaded and used by the debugger functionality in HEW.
The build process can be customized in several ways. For instance, you can add your own phase, disable a phase,
delete phases and so forth. These advanced build issues are left to chapter 3, “Advanced Build Features”. In this
chapter, only the general principles and basic features will be detailed.
相關(guān)PDF資料
PDF描述
HD64F7047 Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Debugger Users Manual/Cross tool
HD64F7050S SuperH RISC Engine SH-DSP Software Application Notes/Q&A
HD64F7051 Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Debugger Users Manual/Cross tool
HD64F7052 SuperH RISC Engine SH-DSP Software Application Notes/Q&A
HD6809E 8-Bit Microprocessor
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
HD64F7046F50 制造商:Renesas Electronics Corporation 功能描述:MCU 32BIT SUPERH RISC 256KB FLASH 80PQFP - Trays 制造商:Renesas Electronics 功能描述:SuperH 50MHz Cut Tape
HD64F7046F50V 功能描述:IC SUPERH MCU FLASH 80QFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:SuperH® SH7046 標(biāo)準(zhǔn)包裝:96 系列:PIC® 16F 核心處理器:PIC 芯體尺寸:8-位 速度:20MHz 連通性:I²C，SPI 外圍設(shè)備:欠壓檢測/復(fù)位，POR，PWM，WDT 輸入/輸出數(shù):11 程序存儲器容量:3.5KB（2K x 14） 程序存儲器類型:閃存 EEPROM 大小:- RAM 容量:128 x 8 電壓 - 電源 (Vcc/Vdd):2.3 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 8x10b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 125°C 封裝/外殼:14-TSSOP（0.173"，4.40mm 寬） 包裝:管件
HD64F7047F28 制造商:Renesas Electronics Corporation 功能描述:
HD64F7047F50MV 功能描述:MCU 5V 256K PB-FREE 100-QFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:SuperH® SH7047 標(biāo)準(zhǔn)包裝:250 系列:56F8xxx 核心處理器:56800E 芯體尺寸:16-位 速度:60MHz 連通性:CAN，SCI，SPI 外圍設(shè)備:POR，PWM，溫度傳感器，WDT 輸入/輸出數(shù):21 程序存儲器容量:40KB（20K x 16） 程序存儲器類型:閃存 EEPROM 大小:- RAM 容量:6K x 16 電壓 - 電源 (Vcc/Vdd):2.25 V ~ 3.6 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 6x12b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 125°C 封裝/外殼:48-LQFP 包裝:托盤 配用:MC56F8323EVME-ND - BOARD EVALUATION MC56F8323
HD64F7047F50V 功能描述:IC H8 MCU FLASH 256K 100TQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:SuperH® SH7047 標(biāo)準(zhǔn)包裝:1 系列:AVR® ATmega 核心處理器:AVR 芯體尺寸:8-位 速度:16MHz 連通性:I²C，SPI，UART/USART 外圍設(shè)備:欠壓檢測/復(fù)位，POR，PWM，WDT 輸入/輸出數(shù):32 程序存儲器容量:32KB（16K x 16） 程序存儲器類型:閃存 EEPROM 大小:1K x 8 RAM 容量:2K x 8 電壓 - 電源 (Vcc/Vdd):2.7 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 8x10b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 125°C 封裝/外殼:44-TQFP 包裝:剪切帶 (CT) 其它名稱:ATMEGA324P-B15AZCT
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