參數(shù)資料
型號: HD64F38024
英文描述: H8/38024 Series. H8/38024F-ZTAT Hardware Manual
中文描述: H8/38024系列。 H8/38024F-ZTAT硬件手冊
文件頁數(shù): 40/67頁
文件大?。?/td> 382K
代理商: HD64F38024
Rev. 2.0, 03/06/02, 36
3.
Advanced Build Features
This chapter explains the more advanced build concepts.
3.1
The Build Process Revisited
Chapter 2, “Build Basics” began by describing the build process in terms of a compiler, an assembler and a
linker (figure 2.1). This will be the case for most installations of the Hitachi Embedded Workshop. However, if
you want to begin changing the build process (e.g. adding and removing phases) then it is important to
understand more about the way in which a build functions.
3.1.1
What is a Build?
Building a project means applying a set of tools upon certain input files in order to produce the desired output.
Thus, we apply a compiler upon C/C++ source files in order to create object files, we apply an assembler upon
assembler source files in order to create object files and so forth. At each step or “phase” of the build, we apply a
different tool upon a different set of input files. Figure 3.1 presents another view of the build process.
BEGIN
END
PHASE 1
PHASE 2
PHASE 3
PHASE X
Phase 1 Output Files
Phase 2 Output Files
Phase 1 Input Files
Phase 2 Input Files
Phase 3 Output Files
Phase X Output Files
Phase 3 Input Files
Phase X Input Files
Figure 3.1: Build Process
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HD64F5388 F-ZTAT Microcomputer On-Board Programming Application Note
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
HD64F38024DV 功能描述:IC H8/SLP MCU FLASH 80QFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器, 系列:H8® H8/300L SLP 產(chǎn)品培訓(xùn)模塊:CAN Basics Part-1 CAN Basics Part-2 Electromagnetic Noise Reduction Techniques Part 1 M16C Product Overview Part 1 M16C Product Overview Part 2 標(biāo)準包裝:1 系列:M16C™ M32C/80/87 核心處理器:M32C/80 芯體尺寸:16/32-位 速度:32MHz 連通性:EBI/EMI,I²C,IEBus,IrDA,SIO,UART/USART 外圍設(shè)備:DMA,POR,PWM,WDT 輸入/輸出數(shù):121 程序存儲器容量:384KB(384K x 8) 程序存儲器類型:閃存 EEPROM 大小:- RAM 容量:24K x 8 電壓 - 電源 (Vcc/Vdd):3 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 34x10b,D/A 2x8b 振蕩器型:內(nèi)部 工作溫度:-20°C ~ 85°C 封裝/外殼:144-LQFP 包裝:托盤 產(chǎn)品目錄頁面:749 (CN2011-ZH PDF) 配用:R0K330879S001BE-ND - KIT DEV RSK M32C/87
HD64F38024F 功能描述:IC H8 MCU FLASH 32K 80QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器, 系列:H8® H8/300L SLP 產(chǎn)品培訓(xùn)模塊:MCU Product Line Introduction XMEGA Introduction AVR XMEGA USB Connectivity 標(biāo)準包裝:90 系列:AVR® XMEGA 核心處理器:AVR 芯體尺寸:8/16-位 速度:32MHz 連通性:I²C,IrDA,SPI,UART/USART 外圍設(shè)備:欠壓檢測/復(fù)位,DMA,POR,PWM,WDT 輸入/輸出數(shù):50 程序存儲器容量:192KB(96K x 16) 程序存儲器類型:閃存 EEPROM 大小:4K x 8 RAM 容量:16K x 8 電壓 - 電源 (Vcc/Vdd):1.6 V ~ 3.6 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 16x12b; D/A 2x12b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:64-TQFP 包裝:托盤 配用:ATSTK600-RC14-ND - STK600 SOCKET/ADAPTER 64TQFPATSTK600-TQFP64-ND - STK600 SOCKET/ADAPTER 64-TQFPATAVRONEKIT-ND - KIT AVR/AVR32 DEBUGGER/PROGRMMRATAVRISP2-ND - PROGRAMMER AVR IN SYSTEM
HD64F38024FV 制造商:Renesas Electronics Corporation 功能描述:MCU 16BIT/32BIT H8 CISC 32KB FLASH 2.5V/3.3V/5V 80PQFP - Trays
HD64F38024H 功能描述:IC H8 MCU FLASH 32K 80-QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器, 系列:H8® H8/300L SLP 產(chǎn)品培訓(xùn)模塊:MCU Product Line Introduction XMEGA Introduction AVR XMEGA USB Connectivity 標(biāo)準包裝:90 系列:AVR® XMEGA 核心處理器:AVR 芯體尺寸:8/16-位 速度:32MHz 連通性:I²C,IrDA,SPI,UART/USART 外圍設(shè)備:欠壓檢測/復(fù)位,DMA,POR,PWM,WDT 輸入/輸出數(shù):50 程序存儲器容量:192KB(96K x 16) 程序存儲器類型:閃存 EEPROM 大小:4K x 8 RAM 容量:16K x 8 電壓 - 電源 (Vcc/Vdd):1.6 V ~ 3.6 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 16x12b; D/A 2x12b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:64-TQFP 包裝:托盤 配用:ATSTK600-RC14-ND - STK600 SOCKET/ADAPTER 64TQFPATSTK600-TQFP64-ND - STK600 SOCKET/ADAPTER 64-TQFPATAVRONEKIT-ND - KIT AVR/AVR32 DEBUGGER/PROGRMMRATAVRISP2-ND - PROGRAMMER AVR IN SYSTEM
HD64F38024HI 制造商:Renesas Electronics Corporation 功能描述:MCU 3V 32K I-TEMP 80-QFP - Trays