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參數(shù)資料
| 型號： | HD64F3052B |
| 英文描述： | H8/3048 Series. H8/3052 Series.H8/3062 Series. H8/3067 Series.H8/3007 Series E6000 Emulator HS3064BEPI61H Supplementary Information User＇s Manual/Emulator |
| 中文描述： | H8/3048系列。 H8/3052 Series.H8/3062系列。 H8/3067 Series.H8/3007系列E6000仿真HS3064BEPI61H補(bǔ)充資料用戶手冊/仿真器 |
| 文件頁數(shù)： | 34/67頁 |
| 文件大小： | 382K |
| 代理商： | HD64F3052B |
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Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark,
or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for
problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the
information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest
product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s
sales office before using the product in an application that demands especially high quality and reliability or where its
failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics,
nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum
rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics.
Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the
guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ
systemic measures such as fail-safes, so that the equipment incorporating Hitachi product does not cause bodily injury,
fire or other consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written
approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| HD64F3062B | Microcomputer Development Environment System H8S.H8/300 Series High-Performance Embedded Workshop 2 User＇s Manual/Cross tool |
| HD64F3064 | Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Debugger Users Manual/Cross tool |
| HD64F3064B | Microcomputer Development Environment System H8S.H8/300 Series High-Performance Embedded Workshop 2 User＇s Manual/Cross tool |
| HD64F3067 | Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Debugger Users Manual/Cross tool |
| HD64F3068 | Microcomputer Development Environment System H8S.H8/300 Series High-Performance Embedded Workshop 2 User＇s Manual/Cross tool |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HD64F3052BF25 | 功能描述:IC H8 MCU FLASH 512K 100QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:H8® H8/300H 標(biāo)準(zhǔn)包裝:160 系列:S08 核心處理器:S08 芯體尺寸:8-位 速度:40MHz 連通性:I²C，LIN，SCI，SPI 外圍設(shè)備:LCD，LVD，POR，PWM，WDT 輸入/輸出數(shù):53 程序存儲器容量:32KB（32K x 8） 程序存儲器類型:閃存 EEPROM 大小:- RAM 容量:1.9K x 8 電壓 - 電源 (Vcc/Vdd):2.7 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 12x12b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 105°C 封裝/外殼:64-LQFP 包裝:托盤 |
| HD64F3052BF25V | 制造商:Renesas Electronics 功能描述:16 H8 / 300H 25MHz 100QFP Cut Tape 制造商:Renesas Electronics Corporation 功能描述:Semiconductor, Microcontroller 制造商:Renesas 功能描述:MCU 16-bit H8 CISC 512KB Flash 5V 100-Pin PQFP |
| HD64F3052BFI25 | 功能描述:IC H8 MCU FLASH 512K 100QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:H8® H8/300H 產(chǎn)品培訓(xùn)模塊:MCU Product Line Introduction XMEGA Introduction AVR XMEGA USB Connectivity 標(biāo)準(zhǔn)包裝:90 系列:AVR® XMEGA 核心處理器:AVR 芯體尺寸:8/16-位 速度:32MHz 連通性:I²C，IrDA，SPI，UART/USART 外圍設(shè)備:欠壓檢測/復(fù)位，DMA，POR，PWM，WDT 輸入/輸出數(shù):50 程序存儲器容量:192KB（96K x 16） 程序存儲器類型:閃存 EEPROM 大小:4K x 8 RAM 容量:16K x 8 電壓 - 電源 (Vcc/Vdd):1.6 V ~ 3.6 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 16x12b; D/A 2x12b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:64-TQFP 包裝:托盤 配用:ATSTK600-RC14-ND - STK600 SOCKET/ADAPTER 64TQFPATSTK600-TQFP64-ND - STK600 SOCKET/ADAPTER 64-TQFPATAVRONEKIT-ND - KIT AVR/AVR32 DEBUGGER/PROGRMMRATAVRISP2-ND - PROGRAMMER AVR IN SYSTEM |
| HD64F3052BTE25 | 制造商:Renesas Electronics Corporation 功能描述:MCU 5V 512K 100-TQFP - Trays |
| HD64F3052BTE25V | 制造商:Renesas Electronics Corporation 功能描述:MCU 16-bit H8 CISC 512KB Flash 5V 100-Pin TQFP |
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