參數(shù)資料
型號(hào): HD64F2612H
英文描述: Microcontroller
中文描述: 微控制器
文件頁(yè)數(shù): 40/67頁(yè)
文件大?。?/td> 382K
代理商: HD64F2612H
Rev. 2.0, 03/06/02, 36
3.
Advanced Build Features
This chapter explains the more advanced build concepts.
3.1
The Build Process Revisited
Chapter 2, “Build Basics” began by describing the build process in terms of a compiler, an assembler and a
linker (figure 2.1). This will be the case for most installations of the Hitachi Embedded Workshop. However, if
you want to begin changing the build process (e.g. adding and removing phases) then it is important to
understand more about the way in which a build functions.
3.1.1
What is a Build?
Building a project means applying a set of tools upon certain input files in order to produce the desired output.
Thus, we apply a compiler upon C/C++ source files in order to create object files, we apply an assembler upon
assembler source files in order to create object files and so forth. At each step or “phase” of the build, we apply a
different tool upon a different set of input files. Figure 3.1 presents another view of the build process.
BEGIN
END
PHASE 1
PHASE 2
PHASE 3
PHASE X
Phase 1 Output Files
Phase 2 Output Files
Phase 1 Input Files
Phase 2 Input Files
Phase 3 Output Files
Phase X Output Files
Phase 3 Input Files
Phase X Input Files
Figure 3.1: Build Process
相關(guān)PDF資料
PDF描述
HD64F2623 H8S/2623F-ZTAT.On-Chip HCAN Application Notes/Q&A
HD64F2626 Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool
HD64F2633 H8S.H8/300 Series Simulator/Debugger User's Manual/Cross tool
HD64F2633F16 Microcontroller
HD64F2633F16I Microcontroller
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
HD64F2623FA20 功能描述:IC H8S MCU FLASH 256K 100-QFP RoHS:否 類(lèi)別:集成電路 (IC) >> 嵌入式 - 微控制器, 系列:H8® H8S/2600 標(biāo)準(zhǔn)包裝:60 系列:PSOC® 3 CY8C38xx 核心處理器:8051 芯體尺寸:8-位 速度:67MHz 連通性:EBI/EMI,I²C,LIN,SPI,UART/USART 外圍設(shè)備:電容感應(yīng),DMA,LCD,POR,PWM,WDT 輸入/輸出數(shù):25 程序存儲(chǔ)器容量:64KB(64K x 8) 程序存儲(chǔ)器類(lèi)型:閃存 EEPROM 大小:2K x 8 RAM 容量:8K x 8 電壓 - 電源 (Vcc/Vdd):1.71 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 2x20b,D/A 4x8b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:48-VFQFN 裸露焊盤(pán) 包裝:托盤(pán)
HD64F2623FA20J 功能描述:IC H8S MCU FLASH 256K 100-QFP RoHS:否 類(lèi)別:集成電路 (IC) >> 嵌入式 - 微控制器, 系列:H8® H8S/2600 標(biāo)準(zhǔn)包裝:60 系列:PSOC® 3 CY8C38xx 核心處理器:8051 芯體尺寸:8-位 速度:67MHz 連通性:EBI/EMI,I²C,LIN,SPI,UART/USART 外圍設(shè)備:電容感應(yīng),DMA,LCD,POR,PWM,WDT 輸入/輸出數(shù):25 程序存儲(chǔ)器容量:64KB(64K x 8) 程序存儲(chǔ)器類(lèi)型:閃存 EEPROM 大小:2K x 8 RAM 容量:8K x 8 電壓 - 電源 (Vcc/Vdd):1.71 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 2x20b,D/A 4x8b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:48-VFQFN 裸露焊盤(pán) 包裝:托盤(pán)
HD64F2623FA20J/AU 制造商:Renesas Electronics Corporation 功能描述:
HD64F2623FA20JV 制造商:Renesas Electronics Corporation 功能描述:
HD64F2623FA20V 制造商:Renesas Electronics Corporation 功能描述:MCU 16-bit H8S CISC 256KB Flash 3.3V/5V 100-Pin PQFP 制造商:Renesas Electronics Corporation 功能描述:MCU 16BIT/32BIT H8S CISC 256KB FLASH 3.3V/5V 100PQFP - Trays 制造商:Renesas Electronics 功能描述:H8S 20MHz