參數(shù)資料
型號： HD64F2338
英文描述： Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool
中文描述： 微機開發(fā)環(huán)境系統(tǒng)高性能的Embedded Workshop 2福利部生成器用戶手冊/交叉工具的性能
文件頁數(shù)： 64/67頁
文件大?。?/td> 382K
代理商： HD64F2338
Rev. 2.0, 03/06/02, 58
3.10
Generating a Makefile
The HEW allows you to generate a makefile, which can be used to build parts of your workspace without HEW.
This is particularly useful of you want to send a project to a user who does not have the HEW or if you want to
version control an entire build, including the make components.
To generate a makefile:
1. Ensure that the project, which you want to generate a makefile for, is the current project.
2. Ensure that the build configuration that you want to build the project with is the current configuration.
3.
Select [Build>Generate Makefile].
4.
Once this menu has been selected a dialog is displayed which asks the user what parts of the workspace
need to be added to the make file. (See figure 3.23.)
5.
Select the radio button which is relevant for your make file and then click OK.
Figure 3.23: Generate makefile Dialog
The HEW will create a subdirectory “make” within the current workspace directory and then generate the
makefile into it. It is named after the selection, with a .mak extension for example the current project and
configuration(e.g. project_debug.mak). The executable HMAKE.EXE, located in the HEW installation directory,
is provided for you to execute the makefiles generated by the HEW. It is not intended to execute makefiles,
which have been user modified.
To execute a makefile:
1. Open a command window and change to the “make” directory where the makefile was generated.
2. Execute HMAKE. Its command line is HMAKE.EXE <makefile>.
Note:
The degree portability of a generated makefile is entirely dependent upon how portable the project itself
is. For example, any compiler options, which include full paths to an output directory or include file
directory, will mean that, when given to another user with a different installation, the build will probably
fail. In general use placeholders wherever possible – using a full, specific path should be avoided when
possible.
相關PDF資料
PDF描述
HD64F2339 Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Debugger Users Manual/Cross tool
HD64F2339E Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool
HD64F2345 H8S/2345 Series.H8S/2345 F-ZTAT Hardware Manual
HD64F2357 Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool
HD64F2357F Microcontroller
相關代理商/技術參數(shù)
參數(shù)描述
HD64F2338VFC20 制造商:Renesas Electronics Corporation 功能描述:
HD64F2338VFC25 功能描述:MCU 3V 256K 144-QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:H8® H8S/2300 產(chǎn)品培訓模塊:CAN Basics Part-1 CAN Basics Part-2 Electromagnetic Noise Reduction Techniques Part 1 M16C Product Overview Part 1 M16C Product Overview Part 2 標準包裝:1 系列:M16C™ M32C/80/87 核心處理器:M32C/80 芯體尺寸:16/32-位 速度:32MHz 連通性:EBI/EMI，I²C，IEBus，IrDA，SIO，UART/USART 外圍設備:DMA，POR，PWM，WDT 輸入/輸出數(shù):121 程序存儲器容量:384KB（384K x 8） 程序存儲器類型:閃存 EEPROM 大小:- RAM 容量:24K x 8 電壓 - 電源 (Vcc/Vdd):3 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 34x10b，D/A 2x8b 振蕩器型:內(nèi)部 工作溫度:-20°C ~ 85°C 封裝/外殼:144-LQFP 包裝:托盤 產(chǎn)品目錄頁面:749 (CN2011-ZH PDF) 配用:R0K330879S001BE-ND - KIT DEV RSK M32C/87
HD64F2338VFC25V 制造商:Renesas Electronics Corporation 功能描述:
HD64F2339EVFC25 制造商:Renesas Electronics Corporation 功能描述:MCU 16BIT/32BIT H8S CISC 384KB FLASH 3.3V 144PQFP - Trays
HD64F2339EVFC25V 制造商:Renesas Electronics Corporation 功能描述:MCU 16-bit H8S CISC 384KB Flash 3.3V 144-Pin PQFP
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