參數(shù)資料
型號： HD64F2329B
英文描述： Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool
中文描述： 微機開發(fā)環(huán)境系統(tǒng)高性能的Embedded Workshop 2福利部生成器用戶手冊/交叉工具的性能
文件頁數(shù)： 24/67頁
文件大?。?/td> 382K
代理商： HD64F2329B
Rev. 2.0, 03/06/02, 21
Figure 2.13: Add Application Dialog
5. Enter the name of the tool into the “Name” field. Enter the full path to the tool in the “Command” field
(do not include any parameters). Enter the parameters that are required to open a file in the “Parameters”
field. Be sure to use the $(FULLFILE) placeholder to specify the location file (see appendix C,
“Placeholders”, in the Hitachi Embedded Workshop 2.1 User’s Manual, for more information on
placeholders and their uses). Enter the initial directory, in which you would like the application to run,
into the “Initial directory” field. Click “OK” to create the application.
6. Click “Modify…” to modify an application. The “Modify Application” dialog will be displayed. This
dialog is the same as the “Add Application” dialog described above except that the “Name” field is read
only. Modify the settings as desired and then click “OK”.
7. Click “OK” to set the application for the selected file group.
相關(guān)PDF資料
PDF描述
HD64F2329E Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Debugger Users Manual/Cross tool
HD64F2338 Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool
HD64F2339 Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Debugger Users Manual/Cross tool
HD64F2339E Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool
HD64F2345 H8S/2345 Series.H8S/2345 F-ZTAT Hardware Manual
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
HD64F2329BVF25 功能描述:IC H8S MCU FLASH 384K 128-QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:H8® H8S/2300 標準包裝:60 系列:PSOC® 3 CY8C38xx 核心處理器:8051 芯體尺寸:8-位 速度:67MHz 連通性:EBI/EMI，I²C，LIN，SPI，UART/USART 外圍設(shè)備:電容感應(yīng)，DMA，LCD，POR，PWM，WDT 輸入/輸出數(shù):25 程序存儲器容量:64KB（64K x 8） 程序存儲器類型:閃存 EEPROM 大小:2K x 8 RAM 容量:8K x 8 電壓 - 電源 (Vcc/Vdd):1.71 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 2x20b，D/A 4x8b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:48-VFQFN 裸露焊盤 包裝:托盤
HD64F2329BVF25I 制造商:Renesas Electronics Corporation 功能描述:
HD64F2329BVF25V 制造商:Renesas Electronics Corporation 功能描述:H8S/2300 SERIES MCU
HD64F2329BVF25W 功能描述:IC H8S MCU FLASH 384K 128QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:H8® H8S/2300 產(chǎn)品培訓模塊:MCU Product Line Introduction XMEGA Introduction AVR XMEGA USB Connectivity 標準包裝:90 系列:AVR® XMEGA 核心處理器:AVR 芯體尺寸:8/16-位 速度:32MHz 連通性:I²C，IrDA，SPI，UART/USART 外圍設(shè)備:欠壓檢測/復位，DMA，POR，PWM，WDT 輸入/輸出數(shù):50 程序存儲器容量:192KB（96K x 16） 程序存儲器類型:閃存 EEPROM 大小:4K x 8 RAM 容量:16K x 8 電壓 - 電源 (Vcc/Vdd):1.6 V ~ 3.6 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 16x12b; D/A 2x12b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:64-TQFP 包裝:托盤 配用:ATSTK600-RC14-ND - STK600 SOCKET/ADAPTER 64TQFPATSTK600-TQFP64-ND - STK600 SOCKET/ADAPTER 64-TQFPATAVRONEKIT-ND - KIT AVR/AVR32 DEBUGGER/PROGRMMRATAVRISP2-ND - PROGRAMMER AVR IN SYSTEM
HD64F2329BVTE25V 制造商:Renesas Electronics Corporation 功能描述:
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