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參數(shù)資料
| 型號： | HD64F2317 |
| 英文描述： | Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool |
| 中文描述： | 微機開發(fā)環(huán)境系統(tǒng)高性能的Embedded Workshop 2福利部生成器用戶手冊/交叉工具的性能 |
| 文件頁數(shù)： | 10/67頁 |
| 文件大?。?/td> | 382K |
| 代理商： | HD64F2317 |
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Rev. 2.0, 03/06/02, 9
2.
Build Basics
This chapter explains the general functions of the HEW whilst the more advanced features can be found in
chapter 3, “Advanced Build Features”.
2.1
The Build Process
The typical build process is outlined in figure 2.1. This may not be the exact build process, which your
installation of HEW will use as it depends upon the tools that were provided with your installation of HEW (e.g.
you may not have a compiler for instance). In any case, the principles are the same - each step or phase of the
build takes a set of project files and then builds them, if all succeeds then the next step or phase is executed.
Project
Object
Files
C
Source Files
Assembler
Source Files
Library
Files
Load
Module
BUILD
COMPILER
ASSEMBLER
LINKER
Figure 2.1: Typical Build Process
In the example shown in figure 2.1 the compiler is the first phase, the assembler is the second phase and the
linker is the third and final phase. During the compiler phase, the C source files from the project are compiled in
turn, during the assembler phase, the assembler source files are assembled in turn. During the linker phase all
library files and output files from the compiler and assembler phases are linked together to produce the load
module. This module can then be downloaded and used by the debugger functionality in HEW.
The build process can be customized in several ways. For instance, you can add your own phase, disable a phase,
delete phases and so forth. These advanced build issues are left to chapter 3, “Advanced Build Features”. In this
chapter, only the general principles and basic features will be detailed.
相關PDF資料 |
PDF描述 |
|---|---|
| HD64F2318 | H8S/2319.H8S/2318 Series Hardware Manual |
| HD64F2319 | F-ZTAT Microcomputer On-Board Programming Application Note |
| HD64F2326 | H8S.H8/300 Series Simulator/Debugger User＇s Manual/Cross tool |
| HD64F2328 | Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool |
| HD64F2329 | H8S.H8/300 Series Simulator/Debugger User＇s Manual/Cross tool |
相關代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HD64F2317VTE25 | 制造商:Renesas Electronics Corporation 功能描述:MCU 3V 128K 100-TQFP - Trays |
| HD64F2317VTE25V | 制造商:Renesas Electronics Corporation 功能描述: |
| HD64F2318VF20 | 制造商:Renesas Electronics Corporation 功能描述: |
| HD64F2318VF25 | 制造商:Renesas Electronics Corporation 功能描述:MCU 16BIT/32BIT H8S CISC 256KB FLASH 3.3V 100PQFP - Trays |
| HD64F2318VF25V | 制造商:Renesas Electronics 功能描述:16 H8S/2300 25MHz 100QFP 256KB Tray |
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