參數(shù)資料
型號(hào)： HD64F2238RTF6
英文描述： Microcontroller
中文描述： 微控制器
文件頁(yè)數(shù)： 51/67頁(yè)
文件大?。?/td> 382K
代理商： HD64F2238RTF6
Rev. 2.0, 03/06/02, 46
3.4
Setting Custom Build Phase Options
Once you have defined a custom phase, you will want to specify the command line options that should be used
when it is executed. Each defined phase has a menu option on the [Options] menu. To specify options for that
phase select it. The dialog that will be invoked depends upon whether the custom phase selected was a multiple
or single phase (according to the selection of phase type in figure 3.3b).
Figure 3.10: Custom Options Dialog
The dialog in figure 3.10 is a custom phase options dialog. The implementation of which is slightly different
depending on whether you are using a multiple or single shot phase. On the left-hand side is the project and file
list. It is possible to select multiple projects and files in the same way as Windows explorer to modify the
options for more than one selection. On the right-hand side are the 3 options tabs. This is where you set the
options that you want to apply to the selected file(s). You can also choose which configuration information is
being viewed from the configuration list on the upper left of the dialog box. Each configuration is listed along
with a special entry named “Multiple configurations…”. If you select multiple configurations then a dialog is
displayed which allows you to select more than one configuration. This method is used throughout HEW for
modifying multiple configurations at once.
3.4.1
Options Tab
The “Options” tab (figure 3.11) allows you to define the command line options that will be passed to the phase.
The “Command” field displays the command, which was entered when you defined the phase (figure 3.3d).
Enter into the “Options” field the command line arguments that you would like to pass to the command. If you
want to insert a placeholder, select the relevant placeholder from the “Placeholder” drop-down list box and then
click the “Insert” button. For a detailed description of placeholders see appendix C, “Placeholders” in the
Hitachi Embedded Workshop 2.1 User’s Manual.
相關(guān)PDF資料
PDF描述
HD64F2239 H8S/2239 Series. H8S/2238R Series. H8S/2237 Series. H8S/2227 Series Hardware Manual
HD64F2258 High-Performance Debugging Interface Users Manual/Cross tool
HD64F2264FA13 Microcontroller
HD64F2264FA20 Microcontroller
HD64F2264RFA13 Microcontroller
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
HD64F2238TE13 制造商:Renesas Electronics Corporation 功能描述:
HD64F2239FA16 功能描述:IC H8S MCU FLASH 384K 100-QFP RoHS:否 類(lèi)別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:H8® H8S/2200 產(chǎn)品培訓(xùn)模塊:CAN Basics Part-1 CAN Basics Part-2 Electromagnetic Noise Reduction Techniques Part 1 M16C Product Overview Part 1 M16C Product Overview Part 2 標(biāo)準(zhǔn)包裝:1 系列:M16C™ M32C/80/87 核心處理器:M32C/80 芯體尺寸:16/32-位 速度:32MHz 連通性:EBI/EMI，I²C，IEBus，IrDA，SIO，UART/USART 外圍設(shè)備:DMA，POR，PWM，WDT 輸入/輸出數(shù):121 程序存儲(chǔ)器容量:384KB（384K x 8） 程序存儲(chǔ)器類(lèi)型:閃存 EEPROM 大小:- RAM 容量:24K x 8 電壓 - 電源 (Vcc/Vdd):3 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 34x10b，D/A 2x8b 振蕩器型:內(nèi)部 工作溫度:-20°C ~ 85°C 封裝/外殼:144-LQFP 包裝:托盤(pán) 產(chǎn)品目錄頁(yè)面:749 (CN2011-ZH PDF) 配用:R0K330879S001BE-ND - KIT DEV RSK M32C/87
HD64F2239FA16V 制造商:Renesas Electronics Corporation 功能描述:
HD64F2239FA20IV 制造商:Renesas Electronics Corporation 功能描述:
HD64F2239FA20V 制造商:Renesas Electronics Corporation 功能描述:
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫(xiě)一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*