參數(shù)資料
型號(hào): HD64F2132
英文描述: F-ZTAT Microcomputer Single Power Supply F-ZTAT On-Board Programming
中文描述: 架F - ZTAT微機(jī)單電源供電的F - ZTAT板上編程
文件頁(yè)數(shù): 64/67頁(yè)
文件大?。?/td> 382K
代理商: HD64F2132
Rev. 2.0, 03/06/02, 58
3.10
Generating a Makefile
The HEW allows you to generate a makefile, which can be used to build parts of your workspace without HEW.
This is particularly useful of you want to send a project to a user who does not have the HEW or if you want to
version control an entire build, including the make components.
To generate a makefile:
1. Ensure that the project, which you want to generate a makefile for, is the current project.
2. Ensure that the build configuration that you want to build the project with is the current configuration.
3.
Select [Build>Generate Makefile].
4.
Once this menu has been selected a dialog is displayed which asks the user what parts of the workspace
need to be added to the make file. (See figure 3.23.)
5.
Select the radio button which is relevant for your make file and then click OK.
Figure 3.23: Generate makefile Dialog
The HEW will create a subdirectory “make” within the current workspace directory and then generate the
makefile into it. It is named after the selection, with a .mak extension for example the current project and
configuration(e.g. project_debug.mak). The executable HMAKE.EXE, located in the HEW installation directory,
is provided for you to execute the makefiles generated by the HEW. It is not intended to execute makefiles,
which have been user modified.
To execute a makefile:
1. Open a command window and change to the “make” directory where the makefile was generated.
2. Execute HMAKE. Its command line is HMAKE.EXE <makefile>.
Note:
The degree portability of a generated makefile is entirely dependent upon how portable the project itself
is. For example, any compiler options, which include full paths to an output directory or include file
directory, will mean that, when given to another user with a different installation, the build will probably
fail. In general use placeholders wherever possible – using a full, specific path should be avoided when
possible.
相關(guān)PDF資料
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HD64F2132RFA20 32-Bit Microcontroller
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HD64F2134A F-ZTAT Microcomputer On-Board Programming Application Note
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
HD64F2132FA20 制造商:Renesas Electronics Corporation 功能描述:H8S FLASH - H8S/21 - Trays
HD64F2132RFA20 制造商:Renesas Electronics Corporation 功能描述:MCU 5V 64K 80-QFP - Trays
HD64F2132RFA20V 制造商:Renesas Electronics Corporation 功能描述:MCU 16-bit H8S CISC 64KB Flash 5V 80-Pin PQFP
HD64F2132RTF20 制造商:Renesas Electronics Corporation 功能描述:H8S FLASH - H8S/21 - Trays
HD64F2134AFA20 功能描述:IC H8S MCU FLASH 128K 100-QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器, 系列:H8® H8S/2100 標(biāo)準(zhǔn)包裝:60 系列:PSOC® 3 CY8C38xx 核心處理器:8051 芯體尺寸:8-位 速度:67MHz 連通性:EBI/EMI,I²C,LIN,SPI,UART/USART 外圍設(shè)備:電容感應(yīng),DMA,LCD,POR,PWM,WDT 輸入/輸出數(shù):25 程序存儲(chǔ)器容量:64KB(64K x 8) 程序存儲(chǔ)器類型:閃存 EEPROM 大小:2K x 8 RAM 容量:8K x 8 電壓 - 電源 (Vcc/Vdd):1.71 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 2x20b,D/A 4x8b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:48-VFQFN 裸露焊盤 包裝:托盤