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| 型號(hào)： | HD6475388 |
| 英文描述： | Application Notes Single-Chip Microcomputer Technical Questions and Answers H8/500 CPU |
| 中文描述： | 應(yīng)用筆記單片機(jī)技術(shù)問題和解答H8/500 CPU的 |
| 文件頁數(shù)： | 10/67頁 |
| 文件大?。?/td> | 382K |
| 代理商： | HD6475388 |
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Rev. 2.0, 03/06/02, 9
2.
Build Basics
This chapter explains the general functions of the HEW whilst the more advanced features can be found in
chapter 3, “Advanced Build Features”.
2.1
The Build Process
The typical build process is outlined in figure 2.1. This may not be the exact build process, which your
installation of HEW will use as it depends upon the tools that were provided with your installation of HEW (e.g.
you may not have a compiler for instance). In any case, the principles are the same - each step or phase of the
build takes a set of project files and then builds them, if all succeeds then the next step or phase is executed.
Project
Object
Files
C
Source Files
Assembler
Source Files
Library
Files
Load
Module
BUILD
COMPILER
ASSEMBLER
LINKER
Figure 2.1: Typical Build Process
In the example shown in figure 2.1 the compiler is the first phase, the assembler is the second phase and the
linker is the third and final phase. During the compiler phase, the C source files from the project are compiled in
turn, during the assembler phase, the assembler source files are assembled in turn. During the linker phase all
library files and output files from the compiler and assembler phases are linked together to produce the load
module. This module can then be downloaded and used by the debugger functionality in HEW.
The build process can be customized in several ways. For instance, you can add your own phase, disable a phase,
delete phases and so forth. These advanced build issues are left to chapter 3, “Advanced Build Features”. In this
chapter, only the general principles and basic features will be detailed.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HD6475388F10V | 制造商:Renesas Electronics Corporation 功能描述: |
| HD6477021TE20 | 制造商:Renesas Electronics Corporation 功能描述: |
| HD6477021TE20V | 制造商:Renesas Electronics 功能描述:Cut Tape |
| HD6477021X20 | 制造商:Renesas Electronics Corporation 功能描述:MCU 32-Bit SuperH RISC 32KB EPROM 5V 100-Pin TQFP |
| HD6477021X20V | 功能描述:MCU 5V 32K PB-FREE 100-TQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:SuperH® SH7020 標(biāo)準(zhǔn)包裝:160 系列:S08 核心處理器:S08 芯體尺寸:8-位 速度:40MHz 連通性:I²C，LIN，SCI，SPI 外圍設(shè)備:LCD，LVD，POR，PWM，WDT 輸入/輸出數(shù):53 程序存儲(chǔ)器容量:32KB（32K x 8） 程序存儲(chǔ)器類型:閃存 EEPROM 大小:- RAM 容量:1.9K x 8 電壓 - 電源 (Vcc/Vdd):2.7 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 12x12b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 105°C 封裝/外殼:64-LQFP 包裝:托盤 |
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