參數(shù)資料
型號: HD6473637
英文描述: Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool
中文描述: 微機(jī)開發(fā)環(huán)境系統(tǒng)高性能的Embedded Workshop 2福利部生成器用戶手冊/交叉工具的性能
文件頁數(shù): 42/67頁
文件大?。?/td> 382K
代理商: HD6473637
Rev. 2.0, 03/06/02, 38
3.2
Creating a Custom Build Phase
If you want to execute another tool before, during or after a standard build process then this can be achieved by
creating your own (i.e. custom) build phase.
Select [Options->Build Phases…] to invoke the “Build Phases” dialog (figure 3.2) and then click the “Add…”
button. This will invoke the new build phase wizard dialog (figure 3.3a).
The first step (as shown in figure 3.3a) asks whether you want to create an entirely new phase or whether you
want to add a system phase. A system phase is a “ready made” phase which is already defined within the
toolchain you are using (e.g. compiler, assembler, linker, librarian, etc.) or a utility phase (e.g. file copy,
complexity analyzer etc.).
The “Add an existing system phase” button is inactive if no more system phases are available. Select the “Create
a new custom phase” button to create your own build phase.
Figure 3.3a: New Build Phase Dialog (Step 1)
相關(guān)PDF資料
PDF描述
HD6473637S H8S.H8/300 Series Simulator/Debugger User's Manual/Cross tool
HD6473644H 16-Bit Microcontroller
HD6473644P 16-Bit Microcontroller
HD6473644R H8S.H8/300 Series Simulator/Debugger User's Manual/Cross tool
HD6473657 Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
HD6473637F 制造商:Renesas Electronics Corporation 功能描述:
HD6473644HI 制造商:Renesas Electronics Corporation 功能描述:
HD6473644P 功能描述:IC H8 MCU OTP 32K 64DIP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器, 系列:H8® H8/300L 產(chǎn)品培訓(xùn)模塊:CAN Basics Part-1 CAN Basics Part-2 Electromagnetic Noise Reduction Techniques Part 1 M16C Product Overview Part 1 M16C Product Overview Part 2 標(biāo)準(zhǔn)包裝:1 系列:M16C™ M32C/80/87 核心處理器:M32C/80 芯體尺寸:16/32-位 速度:32MHz 連通性:EBI/EMI,I²C,IEBus,IrDA,SIO,UART/USART 外圍設(shè)備:DMA,POR,PWM,WDT 輸入/輸出數(shù):121 程序存儲器容量:384KB(384K x 8) 程序存儲器類型:閃存 EEPROM 大小:- RAM 容量:24K x 8 電壓 - 電源 (Vcc/Vdd):3 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 34x10b,D/A 2x8b 振蕩器型:內(nèi)部 工作溫度:-20°C ~ 85°C 封裝/外殼:144-LQFP 包裝:托盤 產(chǎn)品目錄頁面:749 (CN2011-ZH PDF) 配用:R0K330879S001BE-ND - KIT DEV RSK M32C/87
HD6473657F 制造商:Renesas Electronics Corporation 功能描述:
HD6473657H 制造商:Renesas Electronics Corporation 功能描述: