參數(shù)資料
型號(hào): HD6433865
英文描述: IC EEPROM 4M 250NS 44LCC
中文描述: 微機(jī)開(kāi)發(fā)環(huán)境系統(tǒng)高性能的Embedded Workshop 2福利部生成器用戶手冊(cè)/交叉工具的性能
文件頁(yè)數(shù): 40/67頁(yè)
文件大?。?/td> 382K
代理商: HD6433865
Rev. 2.0, 03/06/02, 36
3.
Advanced Build Features
This chapter explains the more advanced build concepts.
3.1
The Build Process Revisited
Chapter 2, “Build Basics” began by describing the build process in terms of a compiler, an assembler and a
linker (figure 2.1). This will be the case for most installations of the Hitachi Embedded Workshop. However, if
you want to begin changing the build process (e.g. adding and removing phases) then it is important to
understand more about the way in which a build functions.
3.1.1
What is a Build?
Building a project means applying a set of tools upon certain input files in order to produce the desired output.
Thus, we apply a compiler upon C/C++ source files in order to create object files, we apply an assembler upon
assembler source files in order to create object files and so forth. At each step or “phase” of the build, we apply a
different tool upon a different set of input files. Figure 3.1 presents another view of the build process.
BEGIN
END
PHASE 1
PHASE 2
PHASE 3
PHASE X
Phase 1 Output Files
Phase 2 Output Files
Phase 1 Input Files
Phase 2 Input Files
Phase 3 Output Files
Phase X Output Files
Phase 3 Input Files
Phase X Input Files
Figure 3.1: Build Process
相關(guān)PDF資料
PDF描述
HD6433867 Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool
HD6433875 IC EEPROM PAR 64K 120NS 28SOIC
HD6433875N IC EEPROM PAR 64K 120NS 28SOIC
HD6433875NH IC EEPROM 64K 150NS 28DIP
HD6433875U IC EEPROM 3V 1M 200NS 32DIP
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