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參數(shù)資料
| 型號： | HD6417011 |
| 英文描述： | IC MCU AVR 2K FLASH 20DIP |
| 中文描述： | 微機(jī)開發(fā)環(huán)境系統(tǒng)高性能的Embedded Workshop 2福利部生成器用戶手冊/交叉工具的性能 |
| 文件頁數(shù)： | 66/67頁 |
| 文件大?。?/td> | 382K |
| 代理商： | HD6417011 |
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Rev. 2.0, 03/06/02, iii
Contents
Cautions.......................................................................................................................................... iii
1.
Overview ................................................................................................. 1
1.1
Workspaces, Projects and Files .......................................................................................... 1
1.1.1
The Toolbars .......................................................................................................... 2
1.1.2
The Workspace Window ....................................................................................... 3
1.1.3
The Output Window .............................................................................................. 4
1.2
Launching the HEW ........................................................................................................... 5
1.3
Creating a New Workspace ................................................................................................ 6
1.4
Opening a Workspace ......................................................................................................... 7
1.5
Saving a Workspace............................................................................................................ 7
1.6
Closing a Workspace ..........................................................................................................8
1.7
Using Old Workspaces ....................................................................................................... 8
1.8
Exiting the HEW................................................................................................................. 8
2.
Build Basics............................................................................................. 9
2.1
The Build Process ............................................................................................................... 9
2.2
Project Files......................................................................................................................... 10
2.2.1
Adding Files to a Project ....................................................................................... 11
2.2.2
Removing Files from a Project.............................................................................. 13
2.2.3
Excluding a Project File from Build ..................................................................... 15
2.2.4
Including a Project File in Build ........................................................................... 15
2.3
File Extensions and File Groups......................................................................................... 15
2.4
Specifying How to Build a File .......................................................................................... 22
2.5
Build Configurations........................................................................................................... 23
2.5.1
Selecting a Configuration ...................................................................................... 24
2.5.2
Adding and Deleting Configurations .................................................................... 24
2.6
Building a Project................................................................................................................ 26
2.6.1
Building a Project .................................................................................................. 26
2.6.2
Building Individual Files....................................................................................... 26
2.6.3
Stopping a Build .................................................................................................... 27
2.6.4
Building Multiple Projects .................................................................................... 27
2.6.5
The Output Window .............................................................................................. 28
2.6.6
Controlling the Content of the Output Window ................................................... 28
2.7
File Dependencies ............................................................................................................... 29
2.8
Configuring the Workspace Window ................................................................................. 29
2.8.1
Show Dependencies under Each File .................................................................... 29
2.8.2
Show Standard Library Includes ........................................................................... 30
2.8.3
Show File Paths ..................................................................................................... 31
2.9
Setting the Current Project..................................................................................................31
2.10
Inserting a Project into a Workspace.................................................................................. 31
2.11
Specifying Dependencies between Projects ....................................................................... 33
2.12
Removing a Project from a Workspace.............................................................................. 34
2.13
Relative projects paths in the workspace............................................................................ 35
3.
Advanced Build Features ......................................................................... 36
3.1
The Build Process Revisited ............................................................................................... 36
3.1.1
What is a Build?..................................................................................................... 36
3.2
Creating a Custom Build Phase .......................................................................................... 38
3.3
Ordering Build Phases ........................................................................................................42
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| HD6417014 | IC MCU AVR 2K FLASH 20SOIC |
| HD6417020 | MCU AVR 2K FLASH 15MHZ 20-QFN |
| HD6417020VX12I | MCU AVR 2K FLASH 15MHZ 8-SOIC |
| HD6417020VX20I | MCU AVR 2K FLASH 20MHZ 14SOIC |
| HD6417020X20I | MCU AVR 2K FLASH 20MHZ 14PDIP |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HD6417011VX20V | 功能描述:MPU 5V 0K 100-QFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:SuperH® SH7010 產(chǎn)品培訓(xùn)模塊:CAN Basics Part-1 CAN Basics Part-2 Electromagnetic Noise Reduction Techniques Part 1 M16C Product Overview Part 1 M16C Product Overview Part 2 標(biāo)準(zhǔn)包裝:1 系列:M16C™ M32C/80/87 核心處理器:M32C/80 芯體尺寸:16/32-位 速度:32MHz 連通性:EBI/EMI，I²C，IEBus，IrDA，SIO，UART/USART 外圍設(shè)備:DMA，POR，PWM，WDT 輸入/輸出數(shù):121 程序存儲器容量:384KB（384K x 8） 程序存儲器類型:閃存 EEPROM 大小:- RAM 容量:24K x 8 電壓 - 電源 (Vcc/Vdd):3 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 34x10b，D/A 2x8b 振蕩器型:內(nèi)部 工作溫度:-20°C ~ 85°C 封裝/外殼:144-LQFP 包裝:托盤 產(chǎn)品目錄頁面:749 (CN2011-ZH PDF) 配用:R0K330879S001BE-ND - KIT DEV RSK M32C/87 |
| HD6417014 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Debugger Users Manual/Cross tool |
| HD6417014F28 | 制造商:Renesas Electronics Corporation 功能描述:MCU 32-Bit SuperH RISC ROMLess 5V 112-Pin PQFP Bulk |
| HD6417014F28V | 功能描述:IC SUPERH MPU ROMLESS 112QFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:SuperH® SH7010 產(chǎn)品培訓(xùn)模塊:CAN Basics Part-1 CAN Basics Part-2 Electromagnetic Noise Reduction Techniques Part 1 M16C Product Overview Part 1 M16C Product Overview Part 2 標(biāo)準(zhǔn)包裝:1 系列:M16C™ M32C/80/87 核心處理器:M32C/80 芯體尺寸:16/32-位 速度:32MHz 連通性:EBI/EMI，I²C，IEBus，IrDA，SIO，UART/USART 外圍設(shè)備:DMA，POR，PWM，WDT 輸入/輸出數(shù):121 程序存儲器容量:384KB（384K x 8） 程序存儲器類型:閃存 EEPROM 大小:- RAM 容量:24K x 8 電壓 - 電源 (Vcc/Vdd):3 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 34x10b，D/A 2x8b 振蕩器型:內(nèi)部 工作溫度:-20°C ~ 85°C 封裝/外殼:144-LQFP 包裝:托盤 產(chǎn)品目錄頁面:749 (CN2011-ZH PDF) 配用:R0K330879S001BE-ND - KIT DEV RSK M32C/87 |
| HD6417014RF28 | 功能描述:MCU 5V 0K 112-QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:SuperH® SH7010 標(biāo)準(zhǔn)包裝:250 系列:56F8xxx 核心處理器:56800E 芯體尺寸:16-位 速度:60MHz 連通性:CAN，SCI，SPI 外圍設(shè)備:POR，PWM，溫度傳感器，WDT 輸入/輸出數(shù):21 程序存儲器容量:40KB（20K x 16） 程序存儲器類型:閃存 EEPROM 大小:- RAM 容量:6K x 16 電壓 - 電源 (Vcc/Vdd):2.25 V ~ 3.6 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 6x12b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 125°C 封裝/外殼:48-LQFP 包裝:托盤 配用:MC56F8323EVME-ND - BOARD EVALUATION MC56F8323 |
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