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參數(shù)資料
| 型號(hào)： | HD151TS302ARPEL |
| 廠商： | Renesas Technology Corp. |
| 英文描述： | Spread Spectrum Clock for EMI Solution |
| 中文描述： | 擴(kuò)頻時(shí)鐘的EMI解決方案 |
| 文件頁(yè)數(shù)： | 8/12頁(yè) |
| 文件大?。?/td> | 84K |
| 代理商： | HD151TS302ARPEL |
HD151TS302ARP
Rev.5.00, May.19.2003, page 8 of 12
Application Information
1. Recommended Circuit Configuration
The power supply circuit of the optimal performance on the application of a system should refer to Fig. 2.
VDD decoupling is important to both reduce Jitter and EMI radiation.
The C1 decoupling capacitor should be placed as close to the VDD pin as possible, otherwise the increased
trace inductance will negate its decoupling capability.
The C2 decoupling capacitor shown should be a tantalum type.
8
SEL1
1
7
CLKOUT
6
SEL0
5
SSCCLKOUT
2
VDD
3
GND
GND GND
4
XIN
XOUT
C1
R1
R2
C2
TS300 Series
(Crystal or
Reference input)
(Crystal or
Not connection)
Notes:
C1 = High frequency supply decoupling capacitor.
(0.1
μ
F recommended)
C2 = Low frequency supply decoupling capacitor.
(22
μ
F tantalum type recommended)
R1, R2 = Match value to line impedance.
(22
Reference value)
Figure 2 Recommended circuit configuration
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