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參數資料
| 型號： | HCTS93DMSR |
| 廠商： | INTERSIL CORP |
| 元件分類： | 通用總線功能 |
| 英文描述： | 3-Line To 8-Line Decoders/Demultiplexers 16-CDIP -55 to 125 |
| 中文描述： | HCT SERIES, ASYN NEGATIVE EDGE TRIGGERED 3-BIT UP BINARY COUNTER, CDIP14 |
| 封裝： | SIDE BRAZED, CERAMIC, DIP-14 |
| 文件頁數： | 6/9頁 |
| 文件大?。?/td> | 168K |
| 代理商： | HCTS93DMSR |
485
Specifications HCTS93MS
TABLE 6. APPLICABLE SUBGROUPS
CONFORMANCE GROUPS
METHOD
GROUP A SUBGROUPS
READ AND RECORD
Initial Test (Preburn-In)
100%/5004
1, 7, 9
ICC, IOL/H
Interim Test
I
(Postburn-In)
100%/5004
1, 7, 9
ICC, IOL/H
Interim Test
II
(Postburn-In)
100%/5004
1, 7, 9
ICC, IOL/H
PDA
100%/5004
1, 7, 9, Deltas
Interim Test
III
(Postburn-In)
100%/5004
1, 7, 9
ICC, IOL/IOH
PDA
100%/5004
1, 7, 9, Deltas
Final Test
100%/5004
2, 3, 8A, 8B, 10, 11
Group A (Note 1)
Sample/5005
1, 2, 3, 7, 8A, 8B, 9, 10, 11
Group B
Subgroup B-5
Sample/5005
1, 2, 3, 7, 8A, 8B, 9, 10, 11, Deltas
Subgroups 1, 2, 3, 9, 10, 11
Subgroup B-6
Sample/5005
1, 7, 9
Group D
Sample/5005
1, 7, 9
NOTE:
1. Alternate Group A testing in accordance with Method 5005 of Mil-Std-883 may be exercised.
TABLE 7. TOTAL DOSE IRRADIATION
CONFORMANCE
GROUPS
METHOD
TEST
READ AND RECORD
PRE RAD
POST RAD
PRE RAD
POST RAD
Group E Subgroup 2
5005
1, 7, 9
Table 4
1, 9
Table 4 (Note 1)
NOTE:
1. Except FN Test Which will be performed 100% go/no-go
TABLE 8. STATIC AND DYNAMIC BURN-IN TEST CONNECTIONS
OPEN
GROUND
1/2 VCC = 3V
±
0.5V
VCC = 6V
±
0.5V
OSCILLATOR
50kHz
25kHz
STATIC I BURN-IN (Note 1)
4, 6, 7, 8, 9, 11, 12, 13
1, 2, 3, 10, 14
-
5
-
-
STATIC II BURN-IN (Note 1)
4, 6, 7, 8, 9, 11, 12, 13
10
-
1, 2, 3, 5, 14
-
-
DYNAMIC BURN-IN (Note 2)
4, 6, 7, 13
2, 3, 10
8, 9, 11, 12
5
14
1
NOTES:
1. Each pin except VCC and GND will have a resistor of 10K
±
5% for static burn-in
2. Each pin except VCC and GND will have a resistor of 1K
±
5% for dynamic burn-in
TABLE 9. IRRADIATION TEST CONNECTIONS
OPEN
GROUND
VCC = 5V
±
0.5V
4, 6, 7, 8, 9, 11, 12, 13
10
1, 2, 3, 5, 14
NOTE: Each pin except VCC and GND will have a resistor of 47K
±
5% for irradiation testing. Group E,
Subgroup 2, sample size is 4 dice/wafer 0 failures.
Spec Number
518622
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