參數(shù)資料
型號(hào): HCTS574MS
廠商: Intersil Corporation
英文描述: Hex Inverters 14-CFP -55 to 125
中文描述: 輻射加固八路D類觸發(fā)器,三態(tài),上升沿觸發(fā)
文件頁(yè)數(shù): 10/11頁(yè)
文件大小: 135K
代理商: HCTS574MS
703
HCTS574MS
Die Characteristics
DIE DIMENSIONS:
101 x 85 mils
METALLIZATION:
Type: SiAl
Metal Thickness: 11k
±
1k
GLASSIVATION:
Type: SiO
2
Thickness: 13k
±
2.6k
WORST CASE CURRENT DENSITY:
<2.0 x 10
5
A/cm
2
BOND PAD SIZE:
100
μ
m x 100
μ
m
4 mils x 4 mils
Metallization Mask Layout
HCTS574MS
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCTS574 is TA14460A.
OE
(1)
D0
(2)
D1 (3)
D2 (4)
D4 (6)
D6 (8)
D7
(9)
GND
(10)
Q7
(12)
(14) Q5
(16) Q3
(17) Q2
(18) Q1
Q0
(19)
VCC
(20)
(13) Q6
(15) Q4
CP
(11)
D5 (7)
D3 (5)
Spec Number
518629
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