參數(shù)資料
型號(hào): HCS195MS
廠商: Intersil Corporation
英文描述: Radiation Hardened Inverting 8-Bit Parallel-Input/Serial Output Shift Register
中文描述: 輻射加固反相8位Parallel-Input/Serial輸出移位寄存器
文件頁(yè)數(shù): 9/9頁(yè)
文件大?。?/td> 229K
代理商: HCS195MS
288
HCS195MS
Die Characteristics
DIE DIMENSIONS:
95 x 94 mils
2.380 x 2.410mm
METALLIZATION:
Type: AlSi
Metal Thickness: 11k
±
1k
GLASSIVATION:
Type: SiO
2
Thickness: 13k
±
2.6k
WORST CASE CURRENT DENSITY:
<2.0 x 10
5
A/cm
2
BOND PAD SIZE:
100
μ
m x 100
μ
m
4 x 4 mils
Metallization Mask Layout
HCS195MS
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCS195 is TA14387A.
J
MR
(1)
VCC
(16)
K (3)
D0 (4)
D1 (5)
(6)
D2
(8)
GND
(9)
PE
(10)
CP
(11)Q3
(12) Q3
(13) Q2
(14)
(2)
(7)
D3
(15)
Q1
Q0
Spec Number
518760
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