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參數(shù)資料
| 型號(hào)： | HCP0805-2R2-R |
| 廠商： | COOPER INDUSTRIES |
| 元件分類： | 通用定值電感 |
| 英文描述： | 1 ELEMENT, 2.2 uH, POWDERED IRON-CORE, GENERAL PURPOSE INDUCTOR, SMD |
| 封裝： | CHIP, 0805, ROHS COMPLIANT |
| 文件頁數(shù)： | 1/4頁 |
| 文件大?。?/td> | 410K |
| 代理商： | HCP0805-2R2-R |
Applications:
Voltage Regulator Module (VRM)
Multi-phase regulators
Desktop and servers
Base station equipment
Notebook regulators
Data networking and storage systems
Point-of-load modules
Battery power systems
DCR sensing
Environmental Data:
Storage temperature range: -40°C to +125°C
Operating temperature range: -40°C to +125°C
(Range is application specific)
Solder reflow temperature: J-STD-020D compliant
Packaging:
Supplied in tape-and-reel packaging, 700 parts per reel,
13” diameter reel
Description:
Halogen free
125°C maximum total temperature operation
7.6 x 7.9 x 5.0mm surface mount package
Powder iron core material
Magnetically shielded, low EMI
High current carrying capacity, Low core losses
Controlled DCR tolerance for sensing circuits
Inductance range from 0.40
μH to 2.2μH
Current range from 10.0 to 32 amps
Frequency range up to 2MHz
RoHS compliant
High Current, High Frequency, Power Inductors
HCP0805 Series
1108
BU-SB08798
Page 1 of 4
Data Sheet: 4349
SMD Device
1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10Vrms, 0.0Adc
2 Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms,Isat1
3Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is
necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of
other heat generating components will affect the temperature rise. It is recommended the part
temperature not exceed 125°C under worst case operating conditions verified in the end
application.
4Isat: Peak current for approximately 20% rolloff at +25°C.
5 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI. Bp-p : (Gauss), K:
(K-factor from table), L: (inductance in
μH), ΔI (peak-to-peak ripple current in amps).
6 Part Number Definition: HCP0805-xxx-R
HCP0805 = Product code and size
xxx= Inductance value in
μH, R = decimal point. If no “R” is present, then
third character = # of zeros.
“-R” suffix = RoHS compliant
Product Specifications
Part Number
6
OCL
1 ± 20% (
μH)
FLL
2 Min. (
μH)
Irms
3 (Amps)
Isat
4 @ 25°C (Amps)
DCR (m
Ω) @ 20°C
K-factor
5
HCP0805-R40-R
0.40
0.26
20
32
3.1 ±6.0%
376.0
HCP0805-R68-R
0.68
0.44
17.5
25
4.5 ±6.0%
292.0
HCP0805-1R0-R
1.00
0.64
14.5
22
5.8 ±6.0%
239.0
HCP0805-1R5-R
1.50
0.96
13.3
18
6.8 ±6.0%
202.0
HCP0805-2R2-R
2.20
1.41
10
14
11.2 ±6.0%
175.0
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| HCP0805-R40-R | 功能描述:固定電感器 0.4uH 32A RoHS:否 制造商:AVX 電感:10 uH 容差:20 % 最大直流電流:1 A 最大直流電阻:0.075 Ohms 工作溫度范圍:- 40 C to + 85 C 自諧振頻率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接類型:SMD/SMT 封裝 / 箱體:6.6 mm x 4.45 mm |
| HCP0805-R68-R | 功能描述:固定電感器 0.68uH 25A RoHS:否 制造商:AVX 電感:10 uH 容差:20 % 最大直流電流:1 A 最大直流電阻:0.075 Ohms 工作溫度范圍:- 40 C to + 85 C 自諧振頻率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接類型:SMD/SMT 封裝 / 箱體:6.6 mm x 4.45 mm |
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