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參數(shù)資料
| 型號： | HC9P5502B1-5 |
| 廠商： | HARRIS SEMICONDUCTOR |
| 元件分類： | 模擬傳輸電路 |
| 英文描述： | SLIC Subscriber Line Interface Circuit |
| 中文描述： | TELECOM-SLIC, PDSO24 |
| 文件頁數(shù)： | 11/12頁 |
| 文件大?。?/td> | 132K |
| 代理商： | HC9P5502B1-5 |
4-11
HC-5502B1
Plastic Leaded Chip Carrier Packages (PLCC)
NOTES:
1. Controlling dimension: INCH. Converted millimeter dimensions are
not necessarily exact.
2. Dimensions and tolerancing per ANSI Y14.5M-1982.
3. Dimensions D1 and E1 do not include mold protrusions. Allowable
mold protrusion is 0.010 inch (0.25mm) per side. Dimensions D1
and E1 include mold mismatch and are measured at the extreme
material condition at the body parting line.
4. To be measured at seating plane
5. Centerline to be determined where center leads exit plastic body.
6. “N” is the number of terminal positions.
contact point.
-C-
A1
A
SEATING
PLANE
0.020 (0.51)
MIN
VIEW “A”
D2/E2
0.025 (0.64)
0.042 (1.07)
0.056 (1.42)
0.050 (1.27) TP
E
E1
0.042 (1.07)
0.048 (1.22)
PIN (1) IDENTIFIER
C
D1
D
0.020 (0.51) MAX
3 PLCS
0.026 (0.66)
0.032 (0.81)
0.045 (1.14)
MIN
0.013 (0.33)
0.021 (0.53)
0.025 (0.64)
MIN
VIEW “A” TYP.
0.004 (0.10)
C
-C-
D2/E2
C
N28.45
(JEDEC MS-018AB ISSUE A)
28 LEAD PLASTIC LEADED CHIP CARRIER PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.165
0.180
4.20
4.57
-
A1
0.090
0.120
2.29
3.04
-
D
0.485
0.495
12.32
12.57
-
D1
0.450
0.456
11.43
11.58
3
D2
0.191
0.219
4.86
5.56
4, 5
E
0.485
0.495
12.32
12.57
-
E1
0.450
0.456
11.43
11.58
3
E2
0.191
0.219
4.86
5.56
4, 5
N
28
28
6
Rev. 2 11/97
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| HC-5502B1 | SLIC Subscriber Line Interface Circuit |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HC9P5502B-5 | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| HC9P5502B-9 | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| HC9P5502X | 制造商:Harris Corporation 功能描述: |
| HC9P5504B-5 | 制造商:Harris Corporation 功能描述: 制造商:Intersil Corporation 功能描述: |
| HC9P5504B-5X96 | 制造商:Rochester Electronics LLC 功能描述: 制造商:Intersil Corporation 功能描述: |
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