參數(shù)資料
型號: HC2-R68
元件分類: 通用定值電感
英文描述: 1 ELEMENT, 0.63 uH, GENERAL PURPOSE INDUCTOR, SMD
文件頁數(shù): 1/2頁
文件大?。?/td> 83K
代理商: HC2-R68
ELECTRICAL SPECIFICATIONS
Part
Rated
OCL (1)
Irms (2)
Isat (3)
DCR (4)
Volts (5)
Number
Inductance
H ± 20%
Amperes
Ohms
Sec
H
(Typ.)
(Max.)
HC2-R47
.47
.52
52.9
63.75
.0006
6.87
HC2-R68
.68
.63
52.9
50.00
.0006
6.87
HC2-1R0
1.0
1.15
33.0
42.50
.0013
10.31
HC2-2R2
2.2
2.00
24.3
31.90
.0023
13.75
HC2-4R7
4.7
4.55
17.0
21.25
.0046
20.62
1) Open Circuit Inductance Test Parameters: 300kHz, 0.250 Vrms, 0.0 Adc
2) DC current for an approximate temperature change of 40°C without core loss. Derating is necessary for AC currents.
PCB layout, trace thickness and width, air-flow and proximity of other heat generating components will affect the temperature rise.
It is recommended that the temperature of the part not exceed 125°C under worst case operating conditions verified in the end
application.
3) Peak current for approximately 30% roll-off
4) Values @ 20°C
5) Applied Volt-Time product (V-S) across the inductor. This value represents the applied V-S at 300KHz necessary to generate a core
loss equal to 10% of the total losses for 40°C temperature rise.
Parts packaged in bulk. 45 pieces per tray.
Description
The HC2 family has a compact footprint for high density and
is designed to support the growing power demands of next
generation microprocessors. Ideal for high current/low
voltage applications, the HC2 family utilizes a foil technology
that adds a higher reliability factor for higher frequency
circuit designs over the more traditional magnet wire
normally used.
Features
Suited for IR Reflow Solder
Frequency Range DC to 1MHz
Compact Footprint for High Density
Ideal for Energy Storage Applications
Specifications are subject to change without notice.
High Current 2
SMT Power Inductors
Dimensions in Millimeters
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