
Elevated stack heights
of 20mm, 25mm, 30mm
and 35mm
Choice of
Tin-Lead or
Lead-Free
Solder Charge
Open pin eld for
Single-Ended
or Differential Pair
congurations
Intermateable with
Molex HD Mezz
299, 195
and 143 pins
HDAM–11–12.0–S–13–2
HDAM–23–17.0–S–13–2
WWW.SAMTEC.COM
F-208
Mates with:
HDAF
HD MEZZ ELEVATED ARRAY HDAM
SERIES
HDAM
NO. OF PINS
PER ROW
PLATING
OPTION
OTHER
OPTION
SPECIFICATIONS
i
LEAD
STYLE
Specify
LEAD
STYLE
from
chart
–P
= Pick &
Place Pad
–S
= 30"
(0,76m)
Gold on
contact area,
Matte Tin
on tails and
guide pins
SOLDER
TYPE
LEAD
STYLE
–12.0
–17.0
A
(14,41)
.567
(19,41)
.764
For complete specications and
recommended PCB layouts see
www.samtec.com?HDAM
Insulator Material:
Black Liquid Crystal Polymer
Contact Material:
Copper Alloy
Current Rating:
2.3A @ 80°C ambient
Operating Temp Range:
-55°C to +125°C
Plating:
Au or Sn over
50" (1,27m) Ni
Contact Resistance:
19 m
Ω max
Working Voltage:
200 VAC
Mated Cycles:
100
RoHS Compliant:
Yes
Processing:
Max Processing Temp:
230°C for 60 seconds, or
260°C for 20 seconds 3x
Lead-Free Solderable:
Yes
NO. OF
ROWS
–13
–2
= Lead-Free
Tin Alloy
95.5% Sn/
3.8% Ag/0.7% Cu
Solder Charge
(5,09)
.200
(2,00)
.0787
(1,20)
.0472
(22,50)
.886
No. of
Pins
Per
Row
x
(2,00)
.0787
+
(11,55)
.455
No. of
Pins
Per
Row
x
(2,00)
.0787
+
(16,06)
.632
A
1A
1M
–11, –15, –23
HDAF LEAD STYLE
HDAM
LEAD
STYLE
–08.0
20mm
25mm
–12.0
–17.0
–18.0
30mm
35mm
*Processing conditions will
affect mated height.
MATED HEIGHTS*
DIFFERENTIAL
APPLICATIONS
PAIR
COUNT*
ARRAY
44
60
92
11x13
15x13
23x13
*2:1 S:G Ratio
(1,20)
.0472
(2,00)
.0787
MEZZ
finalinch.com
Note: HD Mezz is a trademark
of Molex Incorporated
Note: Some lengths, styles
and options are non-standard,
non-returnable.
ALSO
AVAILABLE
Tin-Lead Solder Charge.
Call Samtec.
35mm Stack Height
Rated @ -3dB Insertion Loss*
Single-Ended Signaling
9.0 GHz / 18.0 Gbps
Differential Pair Signaling
9.0 GHz / 18.0 Gbps
*Data based on simulations using Final Inch design.