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參數(shù)資料
| 型號(hào)： | HA5024IBZ96 |
| 廠商： | Intersil |
| 文件頁數(shù)： | 8/16頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC OPAMP QUAD 125MHZ 20-SOIC |
| 標(biāo)準(zhǔn)包裝： | 1,000 |
| 應(yīng)用： | 電流反饋 |
| 電路數(shù)： | 4 |
| -3db帶寬： | 125MHz |
| 轉(zhuǎn)換速率： | 350 V/µs |
| 電流 - 電源： | 7.5mA |
| 電流 - 輸出 / 通道： | 20mA |
| 電壓 - 電源，單路/雙路(±)： | ±4.5 V ~ 18 V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 20-SOIC（0.295"，7.50mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 20-SOIC W |
| 包裝： | 帶卷 (TR) |
16
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
3550.6
February 8, 2006
Die Characteristics
DIE DIMENSIONS:
2680
m x 2600m x 483m
METALLIZATION:
Type: Metal 1: AlCu (1%)
Thickness: Metal 1: 8k
±0.4k
Type: Metal 2: AlCu (1%)
Thickness: Metal 2: 16k
±0.8k
SUBSTRATE POTENTIAL (Powered Up):
V-
PASSIVATION:
Type: Nitride
Thickness: 4k
±0.4k
TRANSISTOR COUNT:
248
PROCESS:
High Frequency Bipolar Dielectric Isolation
Metallization Mask Layout
HA5024
9
8
3
220
19
13
11
1
4
6
7
10
12
14
-IN1
OUT1
-IN2
OUT2
OUT3
-IN3
+IN3
DIS3
V-
DIS4
+IN4
-IN4
15
17
18
+IN1
DIS1
V+
DIS2
+IN2
OUT4
HA5024
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