1
HA-2520, HA-2522, HA-2525
20MHz, High Slew Rate, Uncompensated,
High Input Impedance, Operational
Amplifiers
HA-2520, HA-2522, HA-2525 comprise a series of operational
amplifiers delivering an unsurpassed combination of
specifications for slew rate, bandwidth and settling time. These
dielectrically isolated amplifiers are controlled at close loop
gains greater than 3 without external compensation. In addition,
these high performance components also provide low offset
current and high input impedance.
120V/ms slew rate and 200ns (0.2%) settling time of these
amplifiers make them ideal components for pulse amplification
and data acquisition designs. These devices are valuable
components for RF and video circuitry requiring up to 20MHz
gain bandwidth and 2MHz power bandwidth. For accurate signal
conditioning designs the HA-2520, HA-2522, HA-2525’s
superior dynamic specifications are complemented by 10nA
offset current, 100M
Ω input impedance and offset trim capability.
Features
High Slew Rate . . . . . . . . . . . . . . . . . . . . . . . . . . 120V/s
Fast Settling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200ns
Full Power Bandwidth . . . . . . . . . . . . . . . . . . . . . . . 2MHz
Gain Bandwidth (AV ≥ 3) . . . . . . . . . . . . . . . . . . . . 20MHz
High Input Impedance . . . . . . . . . . . . . . . . . . . . . . 100M
Ω
Low Offset Current . . . . . . . . . . . . . . . . . . . . . . . . . . .10nA
Compensation Pin for Unity Gain Capability
Pb-Free Available (RoHS Compliant)
Applications
Data Acquisition Systems
RF Amplifiers
Video Amplifiers
Signal Generators
Pinouts
HA-2520, HA-2525
(8 LD CERDIP, 8 LD PDIP, 8 LD SOIC)
TOP VIEW
HA-2520, HA-2522, HA-2525
(8 LD METAL CAN)
TOP VIEW
Ordering Information
PART
NUMBER
PART
MARKING
TEMP.
RANGE
(°C)
PACKAGE
PKG.
DWG.
NO.
HA2-2520-2
HA2- 2520-2
-55 to +125 8 Ld Metal Can T8.C
HA7-2520-2
-55 to +125 8 Ld CerDIP
F8.3A
HA2-2522-2
HA2- 2522-2
-55 to +125 8 Ld Metal Can T8.C
HA2-2525-5
HA2- 2525-5
0 to +75
8 Ld Metal Can T8.C
HA3-2525-5
HA3- 2525-5
0 to +75
8 Ld PDIP
E8.3
HA2-2525-
5ZR5254*
HA2-252-5ZR5254
0 to +75
8 Ld Metal Can T8.C
HA3-2525-5Z
HA3- 2525-5Z
0 to +75
8 Ld PDIP*
(Pb-Free)
E8.3
HA7-2525-5
HA7- 2525-5
0 to +75
8 Ld CerDIP
F8.3A
HA9P2525-5
2525 5
0 to +75
8 Ld SOIC
M8.15
HA9P2525-5Z
2525 -5Z
0 to +75
8 Ld SOIC
(Pb-Free)
M8.15
NOTES:
1. These Intersil Pb-free plastic packaged products employ special Pb-free
material sets, molding compounds/die attach materials, and 100%
matte tin plate plus anneal (e3 termination finish, which is RoHS
compliant and compatible with both SnPb and Pb-free soldering
operations). Intersil Pb-free products are MSL classified at Pb-free peak
reflow temperatures that meet or exceed the Pb-free requirements of
IPC/JEDEC J STD-020
2. These Intersil Pb-free Hermetic packaged products employ 100% Au
plate - e4 termination finish, which is RoHS compliant and compatible
with both SnPb and Pb-free soldering operations.
*Pb-Free PDIPs can be used for through hole wave solder processing only.
They are not intended for use in Reflow solder processing applications.
BAL
-IN
+IN
V-
1
2
3
4
8
7
6
5
COMP
V+
OUT
BAL
-
+
COMP
OUT
IN-
V-
BAL
IN+
V+
BAL
2
4
6
1
3
7
5
8
-
+
Data Sheet
February 16, 2009
FN2894.9
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
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