參數(shù)資料
型號： GY020SEI
英文描述： IES SERIES 20 WATT
中文描述： 評價(jià)處系列20瓦特
文件頁數(shù)： 3/3頁
文件大?。?/td> 290K
代理商： GY020SEI
OPTIONS
When ordering equipment options, use the following suffix information. Select the option(s) that you prefer and
add them to the model number. Example ordering options are located below the options table.
Example Options:
HBS050ZG-ANT3V = HBS050ZG-A with negative logic, Lucent compatible trim, and 0.95” vertical heatsink.
LES015YJ-3N = LES015YJ with optional trim and enable, negative logic.
QBS066ZG-AT8 = QBS066ZG-A with Lucent compatible trim and 0.110” pin length.
NUCLEAR AND MEDICAL APPLICATIONS - Power-One products are not authorized for use as critical components in life support systems, equipment used
in hazardous environments, or nuclear control systems without the express written consent of the President of Power-One, Inc.
TECHNICAL REVISIONS - The appearance of products, including safety agency certifications pictured on labels, may change depending on the date manu-
factured. Specifications are subject to change without notice.
OPTIONS
SUFFIX
APPLICABLE SERIES
REMARKS
Negative Logic
N
HAS, HBD, HBS, HES, HLS, LES,
TTL "Low" Turns Module ON
QBS, QES, QLS, TES, TQD
TTL "High" Turns Module OFF
Lucent Compatible Trim
T
HAS, HBD, HBS, HES, HLS, QBS, QES,
QLS
Terminal Strip
TS
XWS, XWD, XWT
Trim
1
IAS, LES
Enable
2
IAD, IAS, LES, SMS
Trim and Enable
3
IAS, LES
Current Share
4
SMS
Headerless
Y
Encapsulated EWS, IWS, OWS
PIN LENGTH AND HEATSINK
OPTIONS
Standard Pin Length is 0.180"
(4.6mm)
0.110" (2.8mm) Pin Length
8
All Units (Except SMS)
0.150" (3.8mm) Pin Length
9
All Units (Except SMS)
0.24" (6.1mm) Horizontal Heatsink
1H
All Units (Except DIP, HLS, HLD, QLS,
SIP, SM TLD, and TKD Packages)
Includes Thermal Pad
0.24" (6.1mm) Vertical Heatsink
1V
All Units (Except DIP, HLS, HLD, QLS,
SIP, SM TLD, and TKD Packages)
Includes Thermal Pad
0.45" (11.4mm) Horizontal Heatsink
2H
All Units (Except DIP, HLS, HLD, QLS,
SIP, SM TLD, and TKD Packages)
Includes Thermal Pad
0.45" (11.4mm) Vertical Heatsink
2V
All Units (Except DIP, HLS, HLD, QLS,
SIP, SM TLD, and TKD Packages)
Includes Thermal Pad
0.95" (24.1mm) Horizontal Heatsink
3H
All Units (Except DIP, HLS, HLD, QLS,
SIP, SM TLD, and TKD Packages)
Includes Thermal Pad
0.95" (24.1mm) Vertical Heatsink
3V
All Units (Except DIP, HLS, HLD, QLS,
SIP, SM TLD, and TKD Packages)
Includes Thermal Pad
High
Density
-
Board
Mounted
Power
Division
Powering Communications and Technology
3
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
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