參數(shù)資料
型號: GW5BTJ50K03
廠商: SHARP ELECTRONICS CORP
元件分類: 顯示用LED
英文描述: SINGLE COLOR DISPLAY CLUSTER, PURE WHITE
文件頁數(shù): 10/22頁
文件大小: 331K
代理商: GW5BTJ50K03
DG-106010B
7. Precautions
① Storage conditions
Please follow the conditions below.
·Before opened: Temperature 5 ~ 30 ℃, Relative humidity less than 60 %.
(Before opened LED should be used within a year)
·After opened: Temperature 5 ~ 30 ℃, Relative humidity less than 60 %.
(Please apply soldering within 1 week)
·After opened LED should be kept in an aluminum moisture proof bag with a moisture
absorbent material (silica gel).
·Avoid exposing to air with corrosive gas.
If exposed, electrode surface would be damaged, which may affect soldering.
② Usage conditions
This product is not designed for the use under any of the following conditions.
Please confirm performance and reliability well enough if you use under any of the following conditions;
·In a place with a lot of moisture, dew condensation, briny air, and corrosive gas.
(Cl, H2S, NH3, SO2, NOX, etc.)
·Under the direct sunlight, outdoor exposure, and in a dusty place.
·In water, oil, medical fluid, and organic solvent.
③ Heat radiation
If forward current (IF) is applied to single-state module at any current, there is a risk of damaging LED
or emitting smoke.
Equip with specified heat radiator, and avoid heat stuffed inside the module.
④ Installation
Material of board is alumina ceramic. If installed inappropriately, trouble of no radiation may occur due to
board crack or overheat. Please take particular notice for installation.
Refer to the following cautions on installation.
· Apply thermolysis adhesive, adhesive sheet or peculiar connector when mounted on heat radiator.
In case of applying adhesive or adhesive sheet only, check the effectiveness and reliability before fixing.
If LED comes off from heat radiator, unusual temperature rise entails hazardous phenomena including
device deterioration, coming off of solder at leads, and emitting smoke.
· When LED device is mechanically fixed or locked, Please take into consideration regarding the method of
attachment due to fail from stress.
· Avoid convexly uneven boards.
Convex board is subject to substrate cracking or debasement of heat release.
· It is recommended to apply adhesive or adhesive sheet with high thermal conductivity
for radiation of heat effectively.
· Please take care about the influence of color change of adhesive or adhesive sheet in initial and long term
period, which may affect light output or color due to change of reflectance from backside.
Model No.
Page
GW5BTJ**K03
15 of 18
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