參數(shù)資料
型號: GVT7264A16TS-15
英文描述: x16 SRAM
中文描述: x16的SRAM
文件頁數(shù): 5/9頁
文件大?。?/td> 64K
代理商: GVT7264A16TS-15
AC TEST CONDITIONS
Input pulse levels
0V to 3.0V
Input rise and fall times
1.5ns
Input timing reference levels
1.5V
Output reference levels
1.5V
Output load
See Figures 1 and 2
OUTPUT LOADS
Vt = 1.5V
30 pF
Q
Z
0
= 50
Fig. 1 OUTPUT LOAD EQUIVALENT
50
Q
+5V
480
255
Fig. 2 OUTPUT LOAD EQUIVALENT
5 pF
January 22, 199 9
Rev. 1/99
5
Galvantech, Inc. reserves the right to change products or specifications without notice
GVT72512A8
REVOLUTIONARY PINOUT 512K X 8
GALVANTECH
, NC.
NOTES
1.
All voltages referenced to VSS (GND).
V
IH
+7.0V for t
t
RC /2.
Undershoot:
V
IL
-2.0V for t
t
RC /2
I
cc
is given with no output current. I
cc
increases with greater
output loading and faster cycle times.
2.
Overshoot:
3.
4.
This parameter is sampled.
5.
Test conditions as specified with the output loading as shown in
Fig. 1 unless otherwise noted.
6.
Output loading is specified with C
L
=5pF as in Fig. 2. Transition
is measured +500mV from steady state voltage.
At any given temperature and voltage condition,
t
HZCE is less
than
t
LZCE and
t
HZWE is less than
t
LZWE.
7.
8.
WE# is HIGH for READ cycle.
9.
Device is continuously selected. Chip enable and output enables
are held in their active state.
10. Address valid prior to, or coincident with, latest occurring chip
enable.
11.
t
RC
= Read Cycle Time.
12. Chip Enable and Write Enable can initiate and terminate a
WRITE cycle.
13. Capacitance derating applies to capacitance different from the
load capacitance shown in Fig. 1.
14. Typical values are measured at 5V, 25
o
C and 20ns cycle time.
DATA RETENTION ELECTRICAL CHARACTERISTICS (L Version Only )
DESCRIPTION
CONDITIONS
SYMBOL
MIN
TYP
MAX
UNITS
NOTES
Vcc for Retention Data
Data Retention Current
V
DR
I
CCDR
I
CCDR
2
V
CE# >VCC -0.2;
all other inputs < VSS +0.2
or >VCC -0.2;
all inputs static; f= 0
Vcc = 2V
Vcc = 3V
0.2
0.3
1.6
2.4
mA
mA
13
13
Chip Deselect to
Data Retention Time
Operation Recovery Tim e
t
CDR
0
ns
4
t
R
t
RC
ns
4, 11
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