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參數(shù)資料
| 型號： | GTL2107 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | 12-bit GTL to LVTTL translator with power good control and high-impedance LVTTL and GTL outputs |
| 中文描述： | 12位的GTL的LVTTL與翻譯良好的控制權(quán)和高阻抗輸出LVTTL和GTL |
| 文件頁數(shù)： | 16/20頁 |
| 文件大?。?/td> | 102K |
| 代理商： | GTL2107 |
GTL2008_GTL2107_2
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 02 — 26 September 2006
16 of 20
Philips Semiconductors
GTL2008; GTL2107
GTL translator with power good control and high-impedance outputs
15. Soldering
15.1 Introduction to soldering surface mount packages
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is recommended.
15.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)
vary between 100 seconds and 200 seconds depending on heating method.
Typical reflow temperatures range from 215
°
C to 260
°
C depending on solder paste
material. The peak top-surface temperature of the packages should be kept below:
Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
15.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal results:
Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
For packages with leads on two sides and a pitch (e):
Table 14.
SnPb eutectic process - package peak reflow temperatures (from J-STD-020C
July 2004)
Package thickness
Volume mm
3
< 350
< 2.5 mm
240
°
C + 0/
5
°
C
≥
2.5 mm
225
°
C + 0/
5
°
C
Volume mm
3
≥
350
225
°
C + 0/
5
°
C
225
°
C + 0/
5
°
C
Table 15.
Pb-free process - package peak reflow temperatures (from J-STD-020CJuly
2004)
Package thickness
Volume mm
3
< 350
Volume mm
3
350 to
2000
260
°
C + 0
°
C
250
°
C + 0
°
C
245
°
C + 0
°
C
Volume mm
3
> 2000
< 1.6 mm
1.6 mm to 2.5 mm
≥
2.5 mm
260
°
C + 0
°
C
260
°
C + 0
°
C
250
°
C + 0
°
C
260
°
C + 0
°
C
245
°
C + 0
°
C
245
°
C + 0
°
C
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| GTL2107PW | 功能描述:轉(zhuǎn)換 - 電壓電平 12-BIT XEON GTL TO LVTTL TRANS RoHS:否 制造商:Micrel 類型:CML/LVDS/LVPECL to LVCMOS/LVTTL 傳播延遲時間:1.9 ns 電源電流:14 mA 電源電壓-最大:3.6 V 電源電壓-最小:3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MLF-8 |
| GTL2107PW,112 | 功能描述:轉(zhuǎn)換 - 電壓電平 12-BIT XEON GTL TO RoHS:否 制造商:Micrel 類型:CML/LVDS/LVPECL to LVCMOS/LVTTL 傳播延遲時間:1.9 ns 電源電流:14 mA 電源電壓-最大:3.6 V 電源電壓-最小:3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MLF-8 |
| GTL2107PW,118 | 功能描述:轉(zhuǎn)換 - 電壓電平 12-BIT XEON GTL TO RoHS:否 制造商:Micrel 類型:CML/LVDS/LVPECL to LVCMOS/LVTTL 傳播延遲時間:1.9 ns 電源電流:14 mA 電源電壓-最大:3.6 V 電源電壓-最小:3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MLF-8 |
| GTL2107PW118 | 制造商:Rochester Electronics LLC 功能描述: 制造商:NXP 功能描述: 制造商:NXP Semiconductors 功能描述: |
| GTL2107PW-T | 功能描述:轉(zhuǎn)換 - 電壓電平 12-BIT XEON GTL TO LVTTL TRANS RoHS:否 制造商:Micrel 類型:CML/LVDS/LVPECL to LVCMOS/LVTTL 傳播延遲時間:1.9 ns 電源電流:14 mA 電源電壓-最大:3.6 V 電源電壓-最小:3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MLF-8 |
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