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參數(shù)資料
| 型號(hào)： | GTL2014 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | 4-bit LVTTL to GTL transceiver |
| 中文描述： | 4位LVTTL差動(dòng)的GTL收發(fā)器 |
| 文件頁數(shù)： | 13/15頁 |
| 文件大?。?/td> | 85K |
| 代理商： | GTL2014 |
9397 750 13534
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 — 19 May 2005
13 of 15
Philips Semiconductors
GTL2014
4-bit LVTTL to GTL transceiver
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5]
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7]
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8]
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
[9]
Hot bar soldering or manual soldering is suitable for PMFP packages.
15. Abbreviations
16. Revision history
Table 11:
Acronym
CDM
CMOS
ESD
GTL
HBM
LVTTL
MM
PRR
TTL
Abbreviations
Description
Charged Device Model
Complementary Metal Oxide Silicon
ElectroStatic Discharge
Gunning Transceiver Logic
Human Body Model
Low Voltage Transistor-Transistor Logic
Machine Model
Pulse Rate Repetition
Transistor-Transistor Logic
Table 12:
Document ID
GTL2014_1
Revision history
Release date
20050519
Data sheet status
Product data sheet
Change notice
-
Doc. number
9397 750 13534
Supersedes
-
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| GTL2014PW | 功能描述:總線收發(fā)器 4-BIT LVTTL-GTL XCVR RoHS:否 制造商:Fairchild Semiconductor 邏輯類型:CMOS 邏輯系列:74VCX 每芯片的通道數(shù)量:16 輸入電平:CMOS 輸出電平:CMOS 輸出類型:3-State 高電平輸出電流:- 24 mA 低電平輸出電流:24 mA 傳播延遲時(shí)間:6.2 ns 電源電壓-最大:2.7 V, 3.6 V 電源電壓-最小:1.65 V, 2.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-48 封裝:Reel |
| GTL2014PW,112 | 功能描述:總線收發(fā)器 4-BIT LVTTL-GTL XCVR RoHS:否 制造商:Fairchild Semiconductor 邏輯類型:CMOS 邏輯系列:74VCX 每芯片的通道數(shù)量:16 輸入電平:CMOS 輸出電平:CMOS 輸出類型:3-State 高電平輸出電流:- 24 mA 低電平輸出電流:24 mA 傳播延遲時(shí)間:6.2 ns 電源電壓-最大:2.7 V, 3.6 V 電源電壓-最小:1.65 V, 2.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-48 封裝:Reel |
| GTL2014PW,118 | 功能描述:總線收發(fā)器 4-BIT BI-DIREC NON-LATCH TRAN RoHS:否 制造商:Fairchild Semiconductor 邏輯類型:CMOS 邏輯系列:74VCX 每芯片的通道數(shù)量:16 輸入電平:CMOS 輸出電平:CMOS 輸出類型:3-State 高電平輸出電流:- 24 mA 低電平輸出電流:24 mA 傳播延遲時(shí)間:6.2 ns 電源電壓-最大:2.7 V, 3.6 V 電源電壓-最小:1.65 V, 2.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-48 封裝:Reel |
| GTL2014PW112 | 制造商:Rochester Electronics LLC 功能描述: 制造商:NXP 功能描述: 制造商:NXP Semiconductors 功能描述: |
| GTL2014PW118 | 制造商:Rochester Electronics LLC 功能描述: 制造商:NXP 功能描述: 制造商:NXP Semiconductors 功能描述: |
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