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    參數(shù)資料
    型號: GS881E18BD-150IV
    廠商: GSI TECHNOLOGY
    元件分類: DRAM
    英文描述: 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs
    中文描述: 512K X 18 CACHE SRAM, 7.5 ns, PBGA165
    封裝: 13 X 15 MM, 1 MM PITCH, FPBGA-165
    文件頁數(shù): 17/36頁
    文件大小: 771K
    代理商: GS881E18BD-150IV
    GS881E18/32/36B(T/D)-xxxV
    Rev: 1.00 6/2006
    Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
    17/36
    2006, GSI Technology
    V
    DDQ2
    & V
    DDQ1
    Range Logic Levels
    Parameter
    Symbol
    Min.
    Typ.
    Max.
    Unit
    Notes
    V
    DD
    Input High Voltage
    V
    IH
    0.6*V
    DD
    V
    DD
    + 0.3
    V
    1
    V
    DD
    Input Low Voltage
    V
    IL
    0.3
    0.3*V
    DD
    V
    1
    Notes:
    1.
    The part numbers of Industrial Temperature Range versions end the character “I”. Unless otherwise noted, all performance specifica-
    tions quoted are evaluated for worst case in the temperature range marked on the device.
    Input Under/overshoot voltage must be
    2 V > Vi < V
    DDn
    +2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tKC.
    2.
    Recommended Operating Temperatures
    Parameter
    Symbol
    Min.
    Typ.
    Max.
    Unit
    Notes
    Ambient Temperature (Commercial Range Versions)
    T
    A
    0
    25
    70
    °
    C
    2
    Ambient Temperature (Industrial Range Versions)
    T
    A
    40
    25
    85
    °
    C
    2
    Notes:
    1.
    The part numbers of Industrial Temperature Range versions end the character “I”. Unless otherwise noted, all performance specifica-
    tions quoted are evaluated for worst case in the temperature range marked on the device.
    Input Under/overshoot voltage must be
    2 V > Vi < V
    DDn
    +2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tKC.
    2.
    20% tKC
    V
    SS
    2.0 V
    50%
    V
    SS
    V
    IH
    Undershoot Measurement and Timing
    Overshoot Measurement and Timing
    20% tKC
    V
    DD
    + 2.0 V
    50%
    V
    DD
    V
    IL
    Capacitance
    (T
    A
    = 25
    o
    C, f = 1 MH
    Z
    , V
    DD
    Parameter
    Symbol
    C
    IN
    C
    I/O
    Test conditions
    V
    IN
    = 0 V
    V
    OUT
    = 0 V
    Typ.
    Max.
    Unit
    Input Capacitance
    4
    5
    pF
    Input/Output Capacitance
    6
    7
    pF
    Note:
    These parameters are sample tested.
    = 2.5 V)
    相關(guān)PDF資料
    PDF描述
    GS881E18BD-150V 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs
    GS881E18BD-200IV 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs
    GS881E18BD-200V 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs
    GS881E18BD-250IV 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs
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    相關(guān)代理商/技術(shù)參數(shù)
    參數(shù)描述
    GS881E18BD-150V 制造商:GSI 制造商全稱:GSI Technology 功能描述:512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs
    GS881E18BD-200 制造商:GSI 制造商全稱:GSI Technology 功能描述:512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs
    GS881E18BD-200I 制造商:GSI 制造商全稱:GSI Technology 功能描述:512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs
    GS881E18BD-200IV 制造商:GSI 制造商全稱:GSI Technology 功能描述:512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs
    GS881E18BD-200V 制造商:GSI 制造商全稱:GSI Technology 功能描述:512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs