Rev: 2.05 6/2000
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com
27/31
1999, Giga Semiconductor, Inc.
.
GS84018/32/36T/B-180/166/150/100
TQFP Package Drawing
D
D
E1
E
P
b
e
c
L
L1
A2
A1
Y
θ
Notes:
1.
2.
All dimensions are in millimeters (mm).
Package width and length do not include mold protrusion
Symbol
A1
A2
b
c
D
D1
E
E1
e
L
L1
Y
θ
Description
Standoff
Body Thickness
Lead Width
Lead Thickness
Terminal Dimension
Package Body
Terminal Dimension
Package Body
Lead Pitch
Foot Length
Lead Length
Coplanarity
Lead Angle
Min.
0.05
1.35
0.20
0.09
21.9
19.9
15.9
13.9
Nom.
0.10
1.40
0.30
Max
0.15
1.45
0.40
0.20
22.1
20.1
16.1
14.1
22.0
20.0
16.0
14.0
0.65
0.60
1.00
0.45
0.75
0.10
7
°
0
°
This Material Copyrighted by Its Respective Manufacturer