參數(shù)資料
型號(hào)： GP202
元件分類： 整流器
英文描述： 2 A, 200 V, SILICON, RECTIFIER DIODE, DO-41
文件頁數(shù)： 1/2頁
文件大?。?/td> 160K
代理商： GP202
FEATURES
Data Sheet No. GPPD-200-1B
MECHANICAL SPECIFICATION
Operating and Storage Temperature Range
T T
J,
STG
°C
Typical Junction Capacitance (Note 1)
CJ
pF
40
-65 to +175
4.97 fgppd200
(1) Measured at 1MHz& applied reverse voltage of4 volts
(2) 300 nS available- consult factory
NOTES:
Case: JEDEC DO-41 molded plastic (U/L Flammability Rating 94V-0)
Terminals: Plated axial leads
Soldering: Per MIL-STD 202 Method 208 guaranteed
Polarity: Color band denotes cathode
Mounting Position: Any
Weight: 0.01 Ounces (0.4 Grams)
H11
MECHANICAL DATA
Color Band
Denotes
Cathode
LD (Dia)
BD (Dia)
LL
BL
LL
SERIES GP200- GP210
MAXIMUM RATINGS& ELECTRICAL CHARACTERISTICS
Ratings at 25 °C ambient temperature unless otherwise specified.
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive loads, derate current by 20%.
Average Forward Rectified Current@ T = 75 C,
Lead length= 0.375 in. (9.5 mm)
A
o
PARAMETER (TEST CONDITIONS)
Maximum DC Blocking Voltage
Peak Forward Surge Current( 8.3 mSec single half sine wave
superimposed on rated load)
Maximum Forward Voltage at2 Amps DC
Maximum Average DC Reverse Current
At Rated DC Blocking Voltage
Maximum Peak Recurrent Reverse Voltage
Maximum RMS Voltage
Series Number
IRM
TRR
IO
VRMS
VRRM
VRM
SYMBOL
RATINGS
VOLTS
AMPS
UNITS
VOLTS
A
VFM
IFSM
200
400
140
280
200
800
560
800
400
2
70
1.1
30
5
50
@ T= 25 C
A
o
@ T = 100 C
A
o
Maximum Reverse Recovery Time (I =0.5A, I =1A, I
=0.25A)
F
R
RR
GP210
GP208
GP206
GP200 GP201
GP204
GP202
50
35
50
100
70
100
600
420
600
1000
700
1000
ACTUAL SIZE OF
DO-41 PACKAGE
Sym
In
mm
Minimum
Maximum
BL
BD
LL
LD
1.00
0.028
In
mm
0.107
0.205
0.034
5.2
2.7
0.86
0.160
0.103
25.4
0.71
4.1
2.6
DO- 41
Tel.: (310) 767-1052
Fax: (310) 767-7958
DIOTEC ELECTRONICS CORP.
Gardena, CA 90248
U.S.A
18020 Hobart Blvd., Unit B
EXTREMELY LOW LEAKAGE AT HIGH TEMPERATURES
LOW FORWARD VOLTAGE DROP
1A at T = 75 C WITH NO THERMAL RUNAWAY
A
o
VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM
MECHANICAL STRENGTH AND HEAT DISSIPATION
(Solder Voids: Typical< 2%, Max.< 10% of Die Area)
R
PROPRIETARY
JUNCTION
PASSIVATION FOR SUPERIOR RELIABILITY AND
PERFORMANCE
SOFT GLASS
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