參數(shù)資料
型號: GO1525
英文描述: VCO for GS1560A/61/32. GS9060/62. GS7060/62
中文描述: 壓控振蕩器GS1560A/61/32。 GS9060/62。 GS7060/62
文件頁數(shù): 3/4頁
文件大小: 403K
代理商: GO1525
GENNUM CORPORATION
21969 - 2
3
G
Fig. 1 Reflow Solder Profile
3. SOLDERING RECOMMENDATIONS
3.1 Reflow Conditions
The device will meet the data sheet specifications after
completing the reflow process according to the profile
shown in Figure 1. Recommended soldering conditions are
as follows:
Preheating
150±10
°
C, 60 to 120 sec.
Soldering
Peak 230±5
°
C
Over 200
°
C within 30 sec.
3.2 Soldering Flux
Do not use cleaning type flux. Washing the devices after
using cleaning type flux may damage inner parts and affect
performance.
3.3 Solder Type
Use solder H60, H63 (in JIS Z 3282) or an equivalent type.
This also applies to solder paste.
3.4 Rework or Repair
Rework or repair must only be done once. Do not reflow the
device more than twice; once for initial soldering and once
for remounting after rework.
Do not vibrate the VCO during reflow soldering.
3.5 Endurance To Warp
When the device is soldered on a printed circuit board
(dimension: 100mm x 100mm; thickness: 1.6mm) and the
PCB is warped as shown in Figure 2, the device will not be
cracked or damaged.
Fig. 2 PCB Warp
4. HANDLING RECOMMENDATIONS
4.1 Cleaning
Do not wash the devices.
4.2 Storage
Store the devices out of direct sunlight, at a stable
temperature and humidity. Avoid extreme temperatures,
high
humidity
and
wide
Condensation on the devices may result in reduced quality
and lowered solderability.
temperature
fluctuations.
Avoid dust, sea breezes and corrosive gases (Cl
2
, NH
3
,
SO
2
, NO
X
, etc.).
Use within 6 months after delivery. If the devices are stored
for more than one year, solderability may be degraded.
4.3 Transport
Package the devices for transportation to avoid mechanical
vibration or shock.
4.4 ESD Warning
Avoid poor ground connections and electrostatic discharge
or induction in production.
60 to 120 sec
60 sec
30 sec
230 ± 5
200
160
140
TIME (sec.)
T
VCO
PCB
MAX 2mm
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