參數(shù)資料
型號(hào): GI1101
廠商: GE Security, Inc.
英文描述: GLASS PASSIVATED FAST EFFICIENT RECTIFIER
中文描述: 玻璃鈍化快速高效整流
文件頁數(shù): 1/2頁
文件大小: 52K
代理商: GI1101
GI1101 THRU GI1104
GLASS PASSIVATED FAST EFFICIENT RECTIFIER
Reverse Voltage - 50 to 200 Volts
Forward Current - 2.5 Amperes
FEATURES
High temperature metallurgically bonded construction
Glass passivated cavity-free junction
Superfast recovery time for high efficiency
Low forward voltage, high current capability
Capable of meeting environmental standards
of MIL-S-19500
Hermetically sealed package
Low Leakage
High surge capability
High temperature soldering guaranteed:
350°C/10 seconds, 0.375" (9.5mm) lead length,
5 lbs. (2.3kg) tension
MECHANICAL DATA
Case: JEDEC DO-204AP solid glass body
Terminals: Plated axial leads, solderable per MIL-STD 750,
Method 2026
Polarity: Color band denotes cathode end
Mounting Position: Any
Weight: 0.02 ounce, 0.56 gram
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified.
SYMBOLS
GI1101
GI1102
GI1103
GI1104
UNITS
Maximum repetitive peak reverse voltage
VRRM
50
100
150
200
Volts
Maximum RMS voltage
VRMS
35
70
105
140
Volts
Maximum DC blocking voltage
VDC
50
100
150
200
Volts
Maximum average forward rectified current
0.375" (9.5mm) lead length (SEE FIG.1)
I(AV)
2.5
2.0
Amps
Peak forward surge current
8.3ms single half sine-wave superimposed
IFSM
50.0
Amps
on rated load (JEDEC Method) at rated TL
Maximum instantaneous forward voltage at 2.0A
VF
0.975
1.25
Volts
(NOTE 5)
Maximum DC reverse current
TA=25°C
2.0
10.0
at rated DC blocking voltage
TA=100°C
IR
50.0
200.0
A
Maximum reverse recovery time (NOTE 1)
trr
25.0
50.0
ns
Typical junction capacitance (NOTE 2)
CJ
45.0
pF
Typical thermal resistance (NOTE 1)
R
ΘJA
65.0
(NOTE 4)
R
ΘJL
20.0
°C/W
Operating junction and storage temperature range
TJ, TSTG
-65 to +175
-65 to +150
°C
NOTES:
(1) Reverse recovery test conditions: IF=0.5A, IR=1.0A, Irr=0.25A
(2) Measured at 1.0 MHZ and applied reverse voltage of 4.0 Volts
(3) Thermal resistance from junction to ambient at 0.375" (9.5mm) lead length and mounted on P.C.B. with 0.5 x 0.5” (12 x 12mm) copper pads
(4) Thermal resistance from junction to lead at 0.375" (9.5mm) lead length with both leads attached to heat sinks
(5) Tested at IF=1.0A
4/98
0.034 (0.86)
0.028 (0.71)
DIA.
0.150 (3.8)
0.100 (2.5)
DIA.
1.0 (25.4)
MIN.
0.240 (6.1)
MAX.
1.0 (25.4)
MIN.
DO-204AP
Dimensions in inches and (millimeters)
*Brazed lead assembly is covered by Patent No. 3,930,306
P
A
TENTED*
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