
Rev: 1.00 12/2000
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
21/23
2000, Giga Semiconductor, Inc.
GS81032T/Q-150/138/133/117/100/66
TQFP and QFP Package Drawing
D
D
E1
E
P
b
e
c
L
L1
A2
A1
Y
θ
Notes:
1.
2.
All dimensions are in millimeters (mm).
Package width and length do not include mold protrusion
Symbol
Description
TQFP
Nom.
0.10
1.40
0.30
—
22.0
20.0
16.0
14.0
0.65
0.60
1.00
—
—
QFP
Nom.
0.35
2.72
0.30
0.15
23.2
20.0
17.2
14.0
0.65
0.80
1.60
—
—
Min.
0.05
1.35
0.20
0.09
21.9
19.9
15.9
13.9
—
0.45
—
—
0
°
Max
0.15
1.45
0.40
0.20
22.1
20.1
16.1
14.1
—
0.75
—
0.10
7
°
Min.
0.25
2.55
0.20
0.10
22.95
19.9
17.0
13.9
—
.60
—
—
0
°
Max
0.45
2.90
0.40
0.20
23.45
20.1
17.4
14.1
—
1.00
—
0.10
7
°
A1
A2
b
c
D
D1
E
E1
e
L
L1
Y
θ
Standoff
Body Thickness
Lead Width
Lead Thickness
Terminal Dimension
Package Body
Terminal Dimension
Package Body
Lead Pitch
Foot Length
Lead Length
Coplanarity
Lead Angle