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G1A THRU G1M
GLASS PASSIVATED JUNCTION RECTIFIER
Reverse Voltage - 50 to 1000 Volts
Forward Current - 1.0 Ampere
FEATURES
High temperature metallurgically bonded
constructed rectifiers
Glass passivated cavity-free junction in
D0-204AP package
Hermetically sealed package
1.0 ampere operation
at TA=100
°C with no
thermal runaway
Typical IR less than 0.1A
Capable of meeting environmental standards of
MIL-S-19500
High temperature soldering guaranteed:
350°C/10 seconds, 0.375" (9.5mm) lead length,
5 lbs. (2.3kg) tension
MECHANICAL DATA
Case: JEDEC DO-204AP solid glass body
Terminals: Solder plated axial leads, solderable per
MIL-STD-750, Method 2026
Polarity: Color band denotes cathode end
Mounting Position: Any
Weight: 0.02 ounce, 0.56 gram
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified.
SYMBOLS
G1A
G1B
G1D
G1G
G1J
G1K
G1M
UNITS
Maximum repetitive peak reverse voltage
VRRM
50
100
200
400
600
800
1000
Volts
Maximum RMS voltage
VRMS
35
70
140
280
420
560
700
Volts
Maximum DC blocking voltage
VDC
50
70
200
400
600
800
1000
Volts
Maximum average forward rectified current
0.375” (9.5mm) lead length at TA=100°C
I(AV)
1.0
Amp
Peak forward surge current
8.3ms single half sine-wave superimposed
on rated load (JEDEC Method)
IFSM
50.0
Amps
Maximum instantaneous forward voltage at 1.0A
VF
1.2
1.1
Volts
Maximum full load reverse current, full cycle average
0.375” (9.5mm) lead length at TA=100°C
IR(AV)
200.0
A
Maximum DC reverse current
TA=25°C
2.0
at rated DC blocking voltage
TA=150°C
IR
100.0
A
Typical reverse recovery time (NOTE 1)
trr
1.5
s
Typical junction capacitance (NOTE 2)
CJ
15.0
pF
Typical thermal resistance (NOTE 3)
R
ΘJL
55.0
°C/W
Operating junction and storage temperature range
TJ, TSTG
65 to +175
°C
NOTES:
(1) Measured with IF=0.5A, IR=1.0A, Irr=0.25A
(2) Measured at 1.0 MHZ and applied reverse voltage of 4.0 Volts
(3) Thermal resistance from junction to ambient at 0.375" (9.5mm) lead length P.C.B. mounted
4/98
Dimensions in inches and (millimeters)
*Brazed-lead assembly is covered by Patent No. 3,930,306
P
A
TENTED* 0.034 (0.86)
0.028 (0.71)
DIA.
0.150 (3.8)
0.100 (2.5)
DIA.
1.0 (25.4)
MIN.
0.240 (6.1)
MAX.
1.0 (25.4)
MIN.
DO-204AP