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參數(shù)資料
| 型號： | FW330F1-33T |
| 元件分類： | 電源模塊 |
| 英文描述： | 1-OUTPUT 330 W DC-DC REG PWR SUPPLY MODULE |
| 封裝： | 2.40 X 4.60 INCH, 0.57 INCH HEIGHT, POWER MODULE |
| 文件頁數(shù)： | 16/29頁 |
| 文件大?。?/td> | 347K |
| 代理商： | FW330F1-33T |
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22
Tyco Electronics Corp.
Advance Data Sheet
March 2000
36 to 75 Vdc Input, 3.6, 3.3, 2.5, 2.0, or 1.8 Vdc Output; 180 W to 330 W
FW330 Power Modules: dc-dc Converters;
Thermal Considerations (continued)
Heat Transfer with Heat Sinks (continued)
Example
If an 85 °C case temperature is desired, what is the
minimum airow necessary? Assume the FW330Y1
module is operating at nominal line and an output cur-
rent of 100 A, maximum ambient air temperature of
40 °C, and the heat sink is 1 inch.
Solution
Given: VI = 54 V
IO = 100 A
TA = 40 °C
TC = 85 °C
Heat sink = 1 inch
PD = 68 W
Then solve the following equation:
1 inch heat sink. The minimum airow necessary for
this module depends on heat sink n orientation and is
shown below:
s
1.25 m/s (250 ft./min.) (transverse orientation)
s
1.75 m/s (350 ft./min.) (longitudinal orientation)
Custom Heat Sinks
dominated by the heat sink geometry of the heat sinks
geometry is xed, the heat sinks are not optimized for
all the air speeds shown. It may be necessary to design
a custom heat sink that provides lower thermal resis-
tance than the ones used in this testing or to use other
heat transfer removal methods.
A more detailed model can be used to determine the
required thermal resistance of a heat sink to provide
necessary cooling. The total module resistance can be
separated into a resistance from case-to-sink (
θcs) and
sink-to-ambient (
θsa) as shown in Figure 41.
8-1304 (C)
Figure 41. Resistance from Case-to-Sink and Sink-
to-Ambient
When custom heat sinks are used, the interface
between the module and the heat sink base should be
lled with a thermally conductive material (like a ther-
mal grease or a thermal pad/foil) to reduce the thermal
resistance between the module and the heat sink. It is
recommended that the material is at least 6 mils thick
to compensate for atness differences between the
module and the heat sink. Also, special considerations
should be paid to the atness and surface nish of the
heat sink base to ensure the lowest thermal interface
resistance feasible.
For a managed interface using thermal grease or foils,
a value of
θcs = 0.1 °C/W to 0.3 °C/W is typical. The
solution for heat sink resistance is:
This equation assumes that all dissipated power must
be shed by the heat sink. Depending on the user-
dened application environment, a more accurate
model, including heat transfer from the sides and bot-
tom of the module, can be used. This equation provides
a conservative estimate for such instances.
EMC Considerations
For assistance with designing for EMC compliance,
please refer to the FLTR100V10 data sheet
(DS99-294EPS).
Layout Considerations
Copper paths must not be routed beneath the power
module mounting inserts. For additional layout guide-
lines, refer to the FLTR100V10 data sheet
(DS99-294EPS).
θca
TC
TA
–
()
PD
------------------------
=
θca
85
40
–
()
68
------------------------
=
θca 0.66 °C/W
=
PD
TC
TS
TA
cs
sa
θsa
TC
TA
–
()
PD
-------------------------
θcs
–
=
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