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參數(shù)資料
| 型號： | FW300F1 |
| 廠商： | LINEAGE POWER LLC |
| 元件分類： | 電源模塊 |
| 英文描述： | 1-OUTPUT 198 W DC-DC REG PWR SUPPLY MODULE |
| 封裝： | MODULE-20 |
| 文件頁數(shù)： | 9/20頁 |
| 文件大?。?/td> | 434K |
| 代理商： | FW300F1 |
Lineage Power
17
Data Sheet
April 2008
dc-dc Converters; 36 to 75 Vdc Input, 3.3 Vdc Output; 165 W to 198 W
FW250F1 and FW300F1 Power Modules:
Thermal Considerations (continued)
Heat Transfer with Heat Sinks (continued)
Then solve the following equation:
0.5 inch heat sink. The minimum airflow necessary for
the FW250F1 module depends on heat sink fin orienta-
tion and is shown below:
n
2.0 m/s (400 ft./min.) (oriented along width)
n
3.0 m/s (600 ft./min.) (oriented along length)
Custom Heat Sinks
A more detailed model can be used to determine the
required thermal resistance of a heat sink to provide
necessary cooling. The total module resistance can be
separated into a resistance from case-to-sink (
θcs) and
sink-to-ambient (
θsa) as shown in Figure 30.
8-1304 (C)
Figure 30. Resistance from Case-to-Sink and Sink-
to-Ambient
For a managed interface using thermal grease or foils,
a value of
θcs = 0.1 °C/W to 0.3 °C/W is typical. The
solution for heat sink resistance is:
This equation assumes that all dissipated power must
be shed by the heat sink. Depending on the user-
defined application environment, a more accurate
model, including heat transfer from the sides and bot-
tom of the module, can be used. This equation pro-
vides a conservative estimate for such instances.
Solder, Cleaning, and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical testing. The result
of inadequate circuit-board cleaning and drying can
affect both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning, and dry-
ing procedures, refer to the Board-Mounted Power
Modules Soldering and Cleaning Application Note
(AP97-021EPS).
EMC Considerations
For assistance with designing for EMC compliance,
please refer to the FLTR100V10 data sheet
(DS98-152EPS).
Layout Considerations
Copper paths must not be routed beneath the power
module standoffs. For additional layout guidelines,
refer to the FLTR100V10 data sheet (DS98-152EPS).
θca
TC
TA
–
()
PD
------------------------
=
θca
85
40
–
()
42
------------------------
=
θca
1.07 °C/W
=
PD
TC
TS
TA
θcs
θsa
→
θsa
TC
TA
–
()
PD
-------------------------
θcs
–
=
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