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參數(shù)資料
| 型號(hào)： | FW250C1 |
| 廠商： | LINEAGE POWER LLC |
| 元件分類： | 電源模塊 |
| 英文描述： | DC-DC REG PWR SUPPLY MODULE |
| 文件頁數(shù)： | 6/20頁 |
| 文件大?。?/td> | 1142K |
| 代理商： | FW250C1 |
14
Lineage Power
Data Sheet
April 2008
dc-dc Converters; 36 to 75 Vdc Input, 15 Vdc Output; 250 W to 300 W
FW250C1 and FW300C1 Power Modules:
Thermal Considerations (continued)
Heat Transfer with Heat Sinks
The power modules have through-threaded, M3 x 0.5
mounting holes, which enable heat sinks or cold plates
to be attached to the module. The mounting torque
must not exceed 0.56 N-m (5 in.-lb.). For the screw
attachment from the pin side, the recommended hole
size on the customer’s PWB around the mounting
holes is 0.130 ± 0.005 inches. If a larger hole is used,
the mounting torque from the pin side must not exceed
0.25 N-m (2.2 in.-lbs.).
Thermal derating with heat sinks is expressed by using
the overall thermal resistance of the module. Total
module thermal resistance (
θca) is defined as the max-
imum case temperature rise (
ΔTC, max) divided by the
module power dissipation (PD):
The location to measure case temperature (TC) is
shown in Figure 18. Case-to-ambient thermal resis-
tance vs. airflow for various heat sink configurations is
obtained by experimental testing of heat sinks, which
are offered in the product catalog.
8-1321 (F)
Figure 21. Case-to-Ambient Thermal Resistance
Curves; Transverse Orientation
8-1320 (F)
Figure 22. Case-to-Ambient Thermal Resistance
Curves; Longitudinal Orientation
These measured resistances are from heat transfer
from the sides and bottom of the module as well as the
top side with the attached heat sink; therefore, the
case-to-ambient thermal resistances shown are gener-
ally lower than the resistance of the heat sink by itself.
The module used to collect the data in Figures 21 and
22 had a thermal-conductive dry pad between the case
and the heat sink to minimize contact resistance.
To choose a heat sink, determine the power dissipated
as heat by the unit for the particular application.
Figure 23 shows typical heat dissipation for a range of
output currents and three voltages for the FW300C1.
8-1743 (F)
Figure 23. FW300C1 Power Dissipation vs. Output
Current at 25 °C
θca
ΔTCmax
,
PD
---------------------
TC TA
–
()
PD
------------------------
==
0
0.5
(100)
1.0
(200)
1.5
(300)
2.0
(400)
2.5
(500)
3.0
(600)
0.0
0.5
3.0
3.5
4.0
4.5
2.5
2.0
1.0
CASE
-TO-AMB
IE
N
T
THERMAL
1.5
AIR VELOCITY, m/s (ft./min.)
RE
SIS
T
ANCE,
θca
(
°C/W)
1 1/2 IN. HEAT SINK
1 IN. HEAT SINK
1/2 IN. HEAT SINK
1/4 IN. HEAT SINK
NO HEAT SINK
0
0.5
(100)
1.0
(200)
1.5
(300)
2.0
(400)
2.5
(500)
3.0
(600)
0.0
0.5
3.0
3.5
4.0
4.5
2.5
2.0
1.0
CASE
-TO-A
MBI
ENT
THERMAL
1.5
AIR VELOCITY, m/s (ft./min.)
R
E
SI
STANCE,
θca
(
°C/W)
1 1/2 IN. HEAT SINK
1 IN. HEAT SINK
1/2 IN. HEAT SINK
1/4 IN. HEAT SINK
NO HEAT SINK
2
6
10
14
12
16
0
30
OUTPUT CURRENT, IO (A)
20
15
25
18
40
20
0
35
10
5
45
50
48
POWER
DISSIPATION,
P
D
(W)
VI = 36 V
VI = 54 V
VI = 75 V
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