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參數(shù)資料
| 型號(hào)： | FW250B1 |
| 廠商： | LINEAGE POWER LLC |
| 元件分類： | 電源模塊 |
| 英文描述： | DC-DC REG PWR SUPPLY MODULE |
| 文件頁(yè)數(shù)： | 7/20頁(yè) |
| 文件大小： | 557K |
| 代理商： | FW250B1 |
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Lineage Power
15
Data Sheet
April 2008
36 Vdc to 75 Vdc Input, 12 Vdc Output; 250 W to 300 W
FW250B1 and FW300B1 Power Modules: dc-dc Converters:
Thermal Considerations (continued)
Heat Transfer with Heat Sinks (continued)
8-1733 (C)
Figure 24. FW300B1 Power Dissipation vs. Output
Current at 25 °C
Example
If an 85 °C case temperature is desired, what is the
minimum airow necessary? Assume the FW300B1
module is operating at VI = 54 V and an output current
of 25 A, maximum ambient air temperature of 40 °C,
and the heat sink is 1 inch.
Solution
Given: VI = 54 V
IO = 25 A
TA = 40 °C
TC = 85 °C
Heat sink = 1 inch
Determine PD by using Figure 23:
PD = 45 W
Then solve the following equation:
Use Figures 21 and 22 to determine air velocity for the
1 inch heat sink. The minimum airow necessary for
the FW300B1 module depends on heat sink n orienta-
tion and is shown below:
s
1.4 m/s (270 ft./min.) (oriented along width)
s
1.7 m/s (330 ft./min.) (oriented along length)
Custom Heat Sinks
A more detailed model can be used to determine the
required thermal resistance of a heat sink to provide
necessary cooling. The total module resistance can be
separated into a resistance from case-to-sink (
θcs) and
θsa) as shown in Figure 25.
8-1304(C)
Figure 25. Resistance from Case-to-Sink and Sink-
to-Ambient
For a managed interface using thermal grease or foils,
a value of
θcs = 0.1 °C/W to 0.3 °C/W is typical. The
solution for heat sink resistance is:
This equation assumes that all dissipated power must
be shed by the heat sink. Depending on the user-
dened application environment, a more accurate
model, including heat transfer from the sides and bot-
tom of the module, can be used. This equation provides
a conservative estimate for such instances.
EMC Considerations
For assistance with designing for EMC compliance,
please refer to the FLTR100V10 data sheet
(DS99-294EPS).
Layout Considerations
Copper paths must not be routed beneath the power
module mounting inserts. For additional layout guide-
lines, refer to the FLTR100V10 data sheet
(DS99-294EPS).
20
0
OUTPUT CURRENT, IO (A)
30
10
5
40
15
25
45
35
50
022
24
2
6
4
8
10
1214 16
1820
VI = 75 V
VI = 54 V
VI = 36 V
POWER
DISSIPATION,
P
D
(W)
θca
TC
TA
–
()
PD
------------------------
=
θca
85
40
–
()
45
------------------------
=
θca 1.0 °C/W
=
PD
TC
TS
TA
cs
sa
θsa
TC
TA
–
()
PD
-------------------------
θcs
–
=
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