參數(shù)資料
型號: FUSB1500MHX
廠商: Fairchild Semiconductor
文件頁數(shù): 6/15頁
文件大?。?/td> 0K
描述: IC USB 2.0 TRANSCEIVER 16-MLP
標(biāo)準(zhǔn)包裝: 3,000
類型: USB 收發(fā)器
驅(qū)動器/接收器數(shù): 1/1
規(guī)程: USB 2.0
電源電壓: 3 V ~ 3.6 V
安裝類型: 表面貼裝
封裝/外殼: 16-WFQFN 裸露焊盤
供應(yīng)商設(shè)備封裝: 16-MLP(3x3)
包裝: 帶卷 (TR)
2008 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FUSB1500 Rev. 1.0.1
14
FUSB1500
/
FUSB1501
USB2.0
Full-Speed
/
Low-Speed
Transceiver
with
Charger
Detection
Physical Dimensions
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES PER
A. SIMILAR TO JEDEC REGISTRATION MO-217,
ASME Y14.5M, 1994
TOP VIEW
BOTTOM VIEW
RECOMMENDED LAND PATTERN
B
A
C
SIDE VIEW
3.0
0.10 C
0.08 C
0.10
CA B
0.05
C
SEATING
PLANE
0.05
0.00
0.8 MAX (0.70-0.80)
0.30~0.40
0.25~0.35
0.10
CA B
0.05
C
0.10
CA B
0.05
C
0.10
CA B
0.05
C
0.50 TYP
0.30 TYP
1.35
3.20
2.20
DETAIL A
PIN #1 IDENT.
D. LANDPATTERN RECOMMENDATION IS PER
FSC INTERNAL DESIGN
E. DRAWING FILENAME: MLP16HBrev4
0.10 C
2X
12X
4X
DETAIL A
(
3.10
2.90
)
(
3.10
2.90
)
PIN #1 IDENT
0.73
0.50
0.73
0.50
1.45 MAX
2.45
2.50
2.45
2.50
1
13
59
NOTES:
Figure 12. 16-Pin, Molded Leadless Package (MLP), JEDEC MO217 Equivalent, 3mm Square
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
Tape and Reel Specifications
Please visit Fairchild Semiconductor’s online packaging area for the most recent tape and reel specifications:
http://www.fairchildsemi.com/packaging/3x3MLP_Pack_TNR_16L.pdf.
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