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參數(shù)資料
| 型號(hào)： | FTR-B2NA4.5Z |
| 廠商： | Fujitsu Limited |
| 英文描述： | 4 POLE (2 FORM C + 2 FORM A) SIGNAL RELAY FOR CENTRAL SWITCHING/ DATA TRANSMISSION |
| 中文描述： | 4極（2 C型2表格A）信號(hào)繼電器中央交換/數(shù)據(jù)傳輸 |
| 文件頁(yè)數(shù)： | 7/8頁(yè) |
| 文件大?。?/td> | 143K |
| 代理商： | FTR-B2NA4.5Z |
7
FTR-B2 Series
NOTFORNEWDESGN
3. Moisture Sensitivity
1. General Information
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Relays produced after the specific date code that is indicated on each data sheet are lead-free
now. Most of our signal and power relays are lead-free. Please refer to Lead-Free Status Info.
(http://www.fcai.fujitsu.com/pdf/LeadFreeLetter.pdf)
Lead free solder paste currently used in relays is Sn-3.0Ag-0.5Cu. From February 2005 forward
Sn-3.0Cu-Ni will be used for FTRB3 and FTR-B4 series relays.
Most signal and some power relays also comply with RoHS. Please refer to individual data
sheets. Relays that are RoHS compliant do not contain the 6 hazardous materials that
are restricted by RoHS directive (lead, mercury, cadmium, chromium IV, PBB, PBDE).
It has been verified that using lead-free relays in leaded assembly process will not cause any
problems (compatible).
“LF” is marked on each outer and inner carton. (No marking on individual relays).
To avoid leaded relays (for lead-free sample, etc.) please consult with area sales office.
We will ship leaded relays as long as the leaded relay inventory exists.
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2. Recommended Lead Free Solder Profile
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Recommended solder paste Sn-3.0Ag-0.5Cu and Sn-3.0 Cu-Ni (only FTR-B3 and FTR-B4 from February 2005)
Reflow Solder condtion
RoHS Compliance and Lead Free Relay Information
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4. Tin Whisker
Moisture Sensitivity Level standard is not applicable to electromechanical realys.
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SnAgCu solder is known as low riskof tin whisker. No considerable length whisker was found by our in-house
test.
5. Solid State Relays
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is between the terminal and the Sn plating to avoid whisker.
Each lead terminal will be changed from solder plating to Sn plating and Nickel plating. A layer of Nickel plating
We highly recommend that you confirm your actual solder conditions
Flow Solder condtion:
Pre-heating:
Soldering:
maximum 120C
dip within 5 sec. at
260C soler bath
Solder by Soldering Iron:
Soldering Iron
Temperature:
Duration:
maximum 360C
maximum 3 sec.
max. 120 sec.
9
0
~
120 sec.
20
~
3
0 sec.
(dur
a
tion)
Cooling
Pre-heat
ing
ol
d
er
ing
P
ea
k
em
p
.
:
max. 2
5
0
C
2
5
0
220
1
3
0
1
7
0
t
e
p
e
r
a
t
e
(
)
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