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參數(shù)資料
| 型號： | FTF3020-M |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Full Frame CCD Image Sensor |
| 中文描述： | 全幀CCD圖像傳感器 |
| 文件頁數(shù)： | 15/16頁 |
| 文件大小： | 224K |
| 代理商： | FTF3020-M |
1999 November
15
Philips Semiconductors
Product specification
Full Frame CCD Image Sensor
FTF3020-M
Package information
Figure 13 - Mechanical drawing of the PGA package of the FTF3020-M
A is the center of the image area.
Position of A:
26.35 ± 0.15 to left edge of package
20.00 ± 0.15 to upper edge of package
1.7 ± 0.15 to bottom of package
Angle of rotation: less than ± 1°
Sensor flatness: < 20 μm (P-V)
Cover glass: Corning 7059
Thickness of cover glass: 1 ± 0.05
Refractive index: n
= 1.53
Double sided AR coating < 1% (430-660 nm) reflection
All drawing units are in mm
3
0
48.26
±
0.27
Chip - bottom package 1.7 ±0.15
1.4 / 100
COVER GLASS
SENSOR CRYSTAL
Chip - cover glass 1.3 ±0.20
EPOXY GLUE
A
TOP VIEW
INDEX
MARK
PIN 1
52.7
±
0.53
26.35
±
0.15
1
2
0
0.46
±
0.05
(2.54)
STAND-OFF PIN
COVER GLASS
4
0
BOTTOM VIEW
Cover glass 1.0 ±0.05
Image sensor chip
4
0
Top cover glass to top chip 2.4 ±0.25
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