參數(shù)資料
型號(hào): FSA2467UMX
廠商: Fairchild Semiconductor
文件頁數(shù): 1/11頁
文件大小: 0K
描述: IC SWITCH DUAL DPDT 16UMLP
標(biāo)準(zhǔn)包裝: 5,000
功能: 開關(guān)
電路: 2 x DPDT
導(dǎo)通狀態(tài)電阻: 400 毫歐
電壓電源: 單電源
電壓 - 電源,單路/雙路(±): 1.65 V ~ 4.3 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 16-UMLP
供應(yīng)商設(shè)備封裝: 16-UMLP(1.8x2.6)
包裝: 帶卷 (TR)
March 2013
2005 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FSA2467 Rev. 1.0.8
FS
A2
467
0.4
Ω
Low
-Voltage
Dua
l
DP
DT
A
nalog
Swit
ch
FSA2467
0.4
Ω Low-Voltage Dual DPDT Analog Switch
Features
Typical 0.4 On Resistance (R
ON) for +2.7V Supply
Features Less then12A ICCT Current when Sn
Input is Lower than VCC
0.25 Maximum R
ON Flatness for +2.7V Supply
3 x 3mm 16-Lead MLP Package
1.8x2.6mm 16-Lead UMLP Package
Broad V
CC Operating Range
Low THD (0.02% Typical for 32 Load)
Applications
Cell Phone
PDA
Portable Media Player
Description
The FSA2467 is a dual Double-Pole, Double-Throw
(DPDT) analog switch. The FSA2467 operates from a
single 1.65V to 4.3V supply. The FSA2467 features an
ultra-low on resistance of 0.4
at a +2.7V supply and
25°C. This device is fabricated with sub-micron CMOS
technology to achieve fast switching speeds and is
designed for break-before-make operation.
FSA2467 features very low quiescent current even when
the control voltage is lower than the VCC supply. This
feature
allows
mobile
handset
applications
direct
interface with baseband processor general-purpose
I/Os.
Ordering Information
Part Number
Top Mark
Package Description
FSA2467MPX
FSA
2467
16-lead Molded Leadless Package (MLP), JEDEC MO-220, 3 x 3mm Square
FSA2467UMX
GC
16-lead Ultrathin Molded Leadless Package (UMLP), 1.8 x 2.6mm
Application Diagram
Figure 1. Application Diagram
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