參數(shù)資料
型號(hào): FSA2267L10X
廠商: Fairchild Semiconductor
文件頁數(shù): 5/14頁
文件大小: 0K
描述: IC SWITCH DUAL SPDT 10MICROPAK
產(chǎn)品變化通告: Die Material, Mold Compound Change 03/Oct/2008
標(biāo)準(zhǔn)包裝: 1
功能: 開關(guān)
電路: 2 x SPDT
導(dǎo)通狀態(tài)電阻: 350 毫歐
電壓電源: 單電源
電壓 - 電源,單路/雙路(±): 1.65 V ~ 3.6 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 10-UFQFN
供應(yīng)商設(shè)備封裝: 10-MicroPak?
包裝: 標(biāo)準(zhǔn)包裝
產(chǎn)品目錄頁面: 1218 (CN2011-ZH PDF)
其它名稱: FSA2267L10XDKR
FSA2267/FSA2267A
0.35
Low-V
olt
a
ge
Dual-SPDT
Analog
Switch
2005 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FSA2267 / FSA2267A Rev. 1.0.5
13
Physical Dimensions
Figure 19. Pb-Free, 10-Lead, Molded Small Outline Package (MSOP), JEDEC MO-187, 3.0mm Wide
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in
any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor
representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairch-
ild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
For current tape and reel specifications, visit Fairchild Semiconductor’s online packaging area:
http://www.fairchildsemi.com/products/analog/pdf/msop10_tr.pdf.
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